Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Roman Salij"'
Publikováno v:
Optifab 2007: Technical Digest.
For many years, Chemical Mechanical Planarization (CMP) has enabled the fabrication of highperformance multilevel integrated circuits for the electronics industry. While CMP techniques are now being used in the manufacturing of optical devices, the c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a358762326204c897a8d2ebad875a6c
https://doi.org/10.1117/12.722153
https://doi.org/10.1117/12.722153
Publikováno v:
SPIE Proceedings.
Chemical Mechanical Polishing, also referred to Chemical Mechanical Planarization (CMP), is one of the enabling technologies which allows the fabrication of high performance multi-level metal structures in IC fabrication. In this paper we will discus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b7e37cf2c2afc8362c917966961fea8
https://doi.org/10.1117/12.681043
https://doi.org/10.1117/12.681043
Autor:
Roman Salij, John Clark, Jeffrey Gilliland, Alicia Walters, Tamara Vincer, Stanley Lesiak, Kevin Moeggenborg
Publikováno v:
Frontiers in Optics.
Chemical-Mechanical Polishing (CMP) was developed for semiconductor manufacturing to allow rapid, reproducible polishing of varied materials. This paper discusses benefits and challenges of CMP for optics manufacturing using aluminum mirror polishing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::322450b3adc533dc10be3de508b13fa2
https://doi.org/10.1364/oft.2006.ofme6
https://doi.org/10.1364/oft.2006.ofme6