Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Roman Kolenak"'
Publikováno v:
Applied Sciences, Vol 14, Iss 4, p 1504 (2024)
The aim of this study was to characterize a Zn-Mg type soldering alloy and direct soldering of SiC ceramics with a copper substrate. The Zn1.5Mg solder exerts a wider melting interval. The temperature of the eutectic reaction was 365 °C, and the liq
Externí odkaz:
https://doaj.org/article/079c5fdfb4ef4f44ac1c7060c1a6b2b9
Publikováno v:
Metals, Vol 11, Iss 4, p 624 (2021)
The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titaniu
Externí odkaz:
https://doaj.org/article/6cf7bbb732e04cfdbd918c9392a747cd
Publikováno v:
Metals, Vol 11, Iss 1, p 27 (2020)
The aim of the research was to characterize the soldering alloy type Zn–Al–Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate. The Zn–Al–Cu solder is of the close-to-eutectic
Externí odkaz:
https://doaj.org/article/c0547446047141899c0dc2ae10feefd7
Publikováno v:
Metals, Vol 10, Iss 3, p 343 (2020)
The aim of this research is to characterize the soldering alloy Zn6Al6Ag, and to study the ultrasonic soldering of an Al2O3/metal−ceramic composite (Al/Al2O3). Zn6Al6Ag solder presents a quasi-eutectic structure with a melting point around 425 °C.
Externí odkaz:
https://doaj.org/article/c6a633821acf4db98b3f6deab9354d75
Publikováno v:
Metals, Vol 10, Iss 2, p 160 (2020)
This research aims to develop the direct soldering of aluminum nitride (AlN) ceramics with a copper substrate using Zn−Al−Mg solder. The solder type, Zn5Al3Mg, has a close-to eutectic composition with a melting point of 359 °C. The microstructur
Externí odkaz:
https://doaj.org/article/e064a68dc3a046c195caa379db3c0cd6
Publikováno v:
Materials; Volume 16; Issue 10; Pages: 3795
The aim of the research was to characterize the soldering alloy type Zn-Mg-Sr and direct the soldering of SiC ceramics with Cu-SiC-based composite. It was investigated whether the proposed composition of the soldering alloy was appropriate for solder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::643e7b2ca3c6b991163f2144782d4fef
Publikováno v:
Soldering & Surface Mount Technology. 35:28-34
Purpose This study aims to investigate soldering of SiC ceramics by using Zn-Al-In-based solders and ultrasonic soldering. The focus was on the quality of soldered joints, examining the boundary of the solder/substrate joint and the strength of the f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::706e8b7e519a3abebe38b97cd6543d88
https://doi.org/10.1108/ssmt-02-2022-0012
https://doi.org/10.1108/ssmt-02-2022-0012
Publikováno v:
International Journal of Engineering Trends and Technology. 69:46-51
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48390827550be498fd1b53890a6c620b
https://doi.org/10.14445/22315381/ijett-v69i10p207
https://doi.org/10.14445/22315381/ijett-v69i10p207
Autor:
Martin Ridzon, Roman Kolenak, Maria Kapustova, Vladimir Simna, Róbert Sobota, Cristina Borzan, Jozef Bílik
Publikováno v:
Revista de Chimie. 71:107-112
The paper describes the structural design, simulation and proper manufacture of a tool for manufacturing of test samples in spherical form. This shape is essential for an innovative assessment of solder wettability, since the small sphere by its idea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::503c441a43aed41d5524ad8162270ff2
https://doi.org/10.37358/rc.20.1.7820
https://doi.org/10.37358/rc.20.1.7820
Publikováno v:
Materials
Materials; Volume 14; Issue 21; Pages: 6369
Materials, Vol 14, Iss 6369, p 6369 (2021)
Materials; Volume 14; Issue 21; Pages: 6369
Materials, Vol 14, Iss 6369, p 6369 (2021)
The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::da3e2baf5431e1ebd74120bb0a61b8b7
http://europepmc.org/articles/PMC8585135
http://europepmc.org/articles/PMC8585135