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pro vyhledávání: '"Roman Doll"'
Autor:
Aakrati Jain, Kamal Sikka, Shidong Li, Juan-Manuel Gomez, Marc Bergendahl, Spyridon Skordas, Jeroen Van Borkulo, Roman Doll, Kees Biesheuvel, Mark Mueller
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Mark Christian Mueller, Jeroen van Borkulo, Kees Biesheuvel, Roman Doll, Dishit P. Parekh, Juan-Manuel Gomez, Kamal K. Sikka, Aakrati Jain, Marc A. Bergendahl
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The recently introduced Direct Bonded Heterogeneous Integration (DBHi) Si bridge technology has chips connected by a bridge housed inside a cavity or trench that is precisely machined in the chip-carrier laminate. The size, thickness, and placement c