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pro vyhledávání: '"Romain Ridremont"'
Autor:
Andy Miller, Akito Hiro, Romain Ridremont, John Slabbekoorn, Samuel Suhard, Robert Hsieh, Warren W. Flack, Ha-Ai Nguyen
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
This study investigates creation of $1.0 \mu \mathrm{m}$ RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is that the Cu overburden removal does no
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6169bd12f6aa5c0f286fbd515d9223c4
https://doi.org/10.1109/eptc.2018.8654363
https://doi.org/10.1109/eptc.2018.8654363
