Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Romain Delamea"'
Publikováno v:
AIMS Electronics and Electrical Engineering, Vol 4, Iss 2, Pp 154-168 (2020)
Wire-bonded multi-chip IGBT power modules constitute the heart of high-current power electronic motor drives. The most common failure mechanism is the degradation of the top-side wires. This deterioration impacts the electrical path and the individua
Externí odkaz:
https://doaj.org/article/96e90415c14a4a3689f2aa009188bc46
