Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Roland Müller-Fiedler"'
Autor:
Manuela Schmidt, Bashir Alabsi, Claas Müller, Roland Zengerle, Martina Daub, Roland Müller-Fiedler, Bettina Günther, Holger Reinecke, Sven Zinober, Michael Stumber, Peter Rothacher, Jochen Rupp
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 6:198-204
We present a technology platform suitable for the mass production of laboratory-on-a-chip devices made of polymers with integrated active and passive components. The presented microfluidic platform with integrated valves and pumps for active flow man
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b85fe9aeca1553aea4dc0b3227921e3
https://doi.org/10.4071/1551-4897-6.4.198
https://doi.org/10.4071/1551-4897-6.4.198
Publikováno v:
Advanced Engineering Materials. 11:316-323
The implementation of microsystems in automotive applications is certainly one of the driving forces for the success of MEMS as an industrial technology on mass production level. In many cases, automotive systems based on microsensors are critical to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ae206196831fdb4ac76f5488a0da6ed
https://doi.org/10.1002/adem.200800290
https://doi.org/10.1002/adem.200800290
Publikováno v:
Microelectronics Reliability. 48:1562-1566
For increasingly miniaturized micromechanical sensors the silicon package is thinned and therefore more sensitive to thermomechanical stresses caused by the production stages. We present a four-point-bending-test that enables the investigation of rel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40f17ed6a34fd68f09002e82ffcefcbe
https://doi.org/10.1016/j.microrel.2008.07.001
https://doi.org/10.1016/j.microrel.2008.07.001
Autor:
Ulrich Kunz, Roland Müller-Fiedler
Publikováno v:
teme. 73:281-292
Es wurden optische Messmethoden hinsichtlich ihrer Eignung zur Charakterisierung von mikromechanischen Bauelementen bewertet. Ein weiterer Schwerpunkt war das Langzeitmonitoring von Materialeigenschaften mittels optischer Messtechniken. Dies wurde am
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d776511200ac624a7b10fd330a0e48f
https://doi.org/10.1524/teme.2006.73.5.281
https://doi.org/10.1524/teme.2006.73.5.281
Publikováno v:
Microelectronics Reliability. 43:1085-1097
In modern cars microsensors and micromechatronic actuators play an essential and still increasingly important role as the interface between the vehicle with its complex functions of motor management, chassis systems, safety as well as comfort and con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc66e87032fe866a69d503b67786cb12
https://doi.org/10.1016/s0026-2714(03)00118-5
https://doi.org/10.1016/s0026-2714(03)00118-5
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
In MEMS industry there is a high demand for reliable hermetic wafer-level encapsulation. This paper presents a methodology to monitor the pressure inside a package after the wafer-level bonding process. Therefore, novel micro-electro-mechanical reson
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dff4568fc212bb44238c70f6e025aadf
https://doi.org/10.1109/estc.2010.5642817
https://doi.org/10.1109/estc.2010.5642817
Autor:
Stefan Finkbeiner, Kurt Weiblen, Harald Neumann, Bob Sulouff, Michael Offenberg, Winfried Schönenborn, Hans-Martin Wiedenmann, Toshio Honma, Roland Müller-Fiedler, Frank Schatz, Franz Lärmer, Henrik Siegle, Jan Peter Stadler, Ralf Henn, Gottfried Flik, Matthias Fürtsch, Johann Riegel, Henrik Jakobsen, Daniel Lapadatu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f97990ccdcef36643de91d6bf384794
https://doi.org/10.1002/9783527619252.ch5h
https://doi.org/10.1002/9783527619252.ch5h
Publikováno v:
Sensors for Automotive Applications, Volume 4
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e2a3d55a8285dea4e1cb69bd073f6cc8
https://doi.org/10.1002/9783527619252.ch3i
https://doi.org/10.1002/9783527619252.ch3i
The reliability of MEMS-based sensors for automotive applications critically depends on their high-cycle load-bearing capacity. To investigate the influence of high-frequency cyclic loading on mechanical properties of polycrystalline silicon, a stati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ce24b278b5e9a0cab02f276ba04dbf64
https://publica.fraunhofer.de/handle/publica/216608
https://publica.fraunhofer.de/handle/publica/216608
Autor:
Daniel Lapadatu, Henrik Jakobsen, Bob Sulouff, Jan Peter Stadler, Michael Offenberg, Franz Lärmer, Ralf Henn, Toshio Honma, Stefan Finkbeiner, Matthias Fürtsch, Harald Neumann, Hans-Martin Wiedenmann, Johann Riegel, Henrik Siegle, Kurt Weiblen, Roland Müller-Fiedler, Winfried Schönenborn, Frank Schatz, Gottfried Flik
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee9e969394c9cb943eb7da38485325bb
https://doi.org/10.1002/3527601422.ch5
https://doi.org/10.1002/3527601422.ch5