Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Roland Frech"'
Publikováno v:
IEEE Transactions on Advanced Packaging. 25:166-173
In this paper, frequency dependencies of delta-I noise caused by variations of the on-chip switching activity have been analyzed by simulations for a complex computer system board with multi-chip module, especially the impact of coincidences with res
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3dbda1e9c3f606adbb5077ee9946635a
https://doi.org/10.1109/tadvp.2002.804783
https://doi.org/10.1109/tadvp.2002.804783
Publikováno v:
IEEE Transactions on Advanced Packaging. 24:294-303
This paper describes an efficient methodology for mid-frequency delta-I noise analysis of the power distribution network of a computer system. The method allows fast and accurate power noise simulations with SPEED97 on highly complex packaging struct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4312432da10defdaf5d9e1502271b72
https://doi.org/10.1109/6040.938296
https://doi.org/10.1109/6040.938296
Autor:
Heinz-Dietrich Bruns, Miroslav Kotzev, Thomas-Michael Winkel, Christian Schuster, Roland Frech, Hubert Harrer, Andreas Huber, Dierk Kaller
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
In this paper the authors present results from the crosstalk analysis of a high density single ended connector and its associated card via array obtained with 12-port vector network analyzer (VNA) measurements in the bandwidth from 10 MHz up to 20 GH
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b98d070ea5cbdee10359728acdc7a70
https://doi.org/10.1109/estc.2010.5642944
https://doi.org/10.1109/estc.2010.5642944
Autor:
Sam Gat-Shang Chu, S. Weitzel, Victor Zyuban, Dieter Wendel, James Allan Kahle, Roland Frech, Ronald Nick Kalla, Joshua Friedrich, Scott A. Taylor, Saiful Islam, Balaram Sinharoy, Robert Cargoni, Joachim Clables, William J. Starke
Publikováno v:
ISSCC
The next processor of the POWER ™ family, called POWER7™ is introduced. Eight quad-threaded cores are integrated together with two memory controllers and high-speed system links on a 567mm2 die, employing 1.2B transistors in 45nm CMOS SOI technol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::465b549c8f3b496a7e329b1c2960e05f
https://doi.org/10.1109/isscc.2010.5434074
https://doi.org/10.1109/isscc.2010.5434074
Publikováno v:
2008 IEEE-EPEP Electrical Performance of Electronic Packaging.
Electro magnetic field effects for broken high frequency (HF) signal returns are analysed for discontinuities in different packaging levels. Board connectors with a huge signal count and high speed signals as well as typical multi chip module structu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b01b4b1007b1b2b11d2d5b27c276b3b3
https://doi.org/10.1109/epep.2008.4675928
https://doi.org/10.1109/epep.2008.4675928
Publikováno v:
2006 IEEE Workship on Signal Propagation on Interconnects.
Special test vehicles with and without broken high frequency signal return paths were built in order to measure their impact on signal integrity. Design guidelines for the transition between different packaging levels are derived and discussed.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e1755c52b96a511f73fa466b6190b49d
https://doi.org/10.1109/spi.2006.289246
https://doi.org/10.1109/spi.2006.289246
Autor:
J.C. Diepenbrock, R. Modinger, G.R. Edlund, Young H. Kwark, T. Gneiting, Christian Schuster, Erich Klink, Roland Frech
Publikováno v:
Proceedings. 45th Annual IEEE Symposium on Foundations of Computer Science.
Current high-end inter-processor links run hundreds of signals at Gigabit per second data rates over one or two connectors and tens of inches of backplane. Suitable connectors have to fulfil tight crosstalk, reflection, and attenuation specifications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a074fc59a9c1ddb777f6388de3e8d110
https://doi.org/10.1109/spi.2004.1409005
https://doi.org/10.1109/spi.2004.1409005
Autor:
C. Siviero, Roland Frech, M. Kindscher, Kenneth L. Christian, Martin Eckert, Hubert Harrer, G. R. Edlund, Thomas Strach, Otto Torreiter, Jochen Supper, A. Huber, K. R. Covi, Dierk Kaller, T.-M. Winkel, G. A. Peterson, Frank E. Bosco, A. Z. Muszynski
Publikováno v:
IBM Journal of Research and Development. 56:2:1-2:19
In this paper, we describe the first- and second-level system packaging structure of the IBM zEnterprise® 196 (z196) enterprise-class server. The design point required a more than 50% overall increase in system performance (in millions of instructio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::245a5d8ccc970543fd746116623d14f6
https://doi.org/10.1147/jrd.2011.2177107
https://doi.org/10.1147/jrd.2011.2177107
Autor:
Roland. Frech, Siegfried. Hofmann
Publikováno v:
Analytical Chemistry. 57:716-719
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce8b29b7fd2b198d243af0a437b985bf
https://doi.org/10.1021/ac00280a031
https://doi.org/10.1021/ac00280a031