Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Roger Quon"'
Publikováno v:
AIP Advances, Vol 8, Iss 5, Pp 055127-055127-9 (2018)
We present an ab initio evaluation of electron scattering mechanisms in Al interconnects from a back-end-of-line (BEOL) perspective. We consider the ballistic conductance as a function of nanowire size, as well as the impact of surface oxidation on e
Externí odkaz:
https://doaj.org/article/9695f71ea2a542cf862995d5132a71db
Autor:
Roger Quon, Kippei Sugita, Iqbal Ali, Brian Sapp, Robert E. Geer, Kaoru Maekawa, Hiroyuki Hashimoto, Alison Gracias, Christopher O'Connell
Publikováno v:
2012 IEEE International Interconnect Technology Conference.
A study using a vapor deposited polyimide (VDP) dielectric liner to electrically isolate through-silicon vias (TSVs) has demonstrated electrical and thermo-mechanical performance superior to sub-atmospheric chemically vapor deposited (SACVD) tetraeth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::160c9360902ade3ea314ddd6de3ddf09
https://doi.org/10.1109/iitc.2012.6251638
https://doi.org/10.1109/iitc.2012.6251638
Autor:
Jamal Qureshi, Roger Quon, Raymond Caramto, Daniel N. Pascual, Sitaram Arkalgud, Larry Smith, Robert Edgeworth, Stephen Olson, Klaus Hummler, Andy Rudack
Publikováno v:
2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference.
Three-dimensional (3D) die stacking using through silicon viae (TSV) promises significant improvements in performance, power consumption and size over traditional edge-connected die stacking (e.g. wire bonds) or package-on-package (PoP) based approac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::567bd85a15b5dafa4a78fa00e882ae9b
https://doi.org/10.1109/asmc.2011.5898174
https://doi.org/10.1109/asmc.2011.5898174
Autor:
Iqbal Ali, Brian Sapp, Roger Quon, Seth Kruger, Kaoru Maekawa, Kippei Sugita, Hiroyuki Hashimoto, Matthias Stender, Jeff Dysard, Sitaram Arkalgud
Publikováno v:
ECS Meeting Abstracts. :2498-2498
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8cbabd4fc291b41b991ee5c975880d26
https://doi.org/10.1149/ma2012-02/29/2498
https://doi.org/10.1149/ma2012-02/29/2498