Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Roger Emigh"'
Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure
Publikováno v:
International Symposium on Microelectronics. 2010:000197-000203
In this paper, a novel flip chip interconnect structure called Bond-On-Lead (BOL) and its ability to reduce stress in the sensitive sub-surface ELK (Extra Low K) layers of the die is presented. BOL is a new low cost flip chip packaging solution which
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::790e7bb2b7205178ae0c0f0b2aea0d15
https://doi.org/10.4071/isom-2010-tp2-paper1
https://doi.org/10.4071/isom-2010-tp2-paper1
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
The market for portable and mobile data access devices connected to a virtual cloud access point is exploding and driving both increased functional convergence as well as increased packaging complexity and sophistication. This is driving an unprecede
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77894a4b8ed6253c9c5b249d348f50ce
https://doi.org/10.1109/ectc.2013.6575830
https://doi.org/10.1109/ectc.2013.6575830
Autor:
KyungOe Kim, Hamid Eslampour, Roger Emigh, HangChul Choi, TaeWoo Lee, Sun Wei, Mukul Joshi, JaeHan Chung
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
The adoption of Tablet devices within the mobile communication space and its penetration into the market segment once held by laptops has resulted in explosive growth rate of these devices, and as a result has created new requirements for the packagi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea605cdbfae97ef9f31264444798f8d4
https://doi.org/10.1109/ectc.2013.6575689
https://doi.org/10.1109/ectc.2013.6575689
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
Embedded Wafer-Level Ball Grid Array (eWLB) technology was developed to provide a wafer-level packaging solution for semiconductor devices requiring a higher integration level and a greater number of external contacts. Essentially, eWLB is a fan-out
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f9625c9e615d9a3620c6edb8e3c8827
https://doi.org/10.1109/eptc.2011.6184503
https://doi.org/10.1109/eptc.2011.6184503
Autor:
Kai Liu, Meenakshi Prashant, Sin Jae Lee, Rajendra D. Pendse, Seung Wook Yoon, Roger Emigh, Gaurav Sharma
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
The drive for small form factor and foot print area packages is being fueled by consumer electronic applications that today constitute 50% of semiconductor revenue. Mobile phones are experiencing explosive growth both in terms of unit shipments and i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b6e205ef8c3b4126dbd231ae7794264
https://doi.org/10.1109/eptc.2010.5702635
https://doi.org/10.1109/eptc.2010.5702635
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Demand for Wafer Level Package (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. WLP is the upcoming future packaging techno
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::074213e9484741c622cefcae207586d5
https://doi.org/10.1109/ectc.2010.5490832
https://doi.org/10.1109/ectc.2010.5490832
Publikováno v:
2009 IEEE MTT-S International Microwave Symposium Digest.
In front-end modules of UWB applications, there are BPFs used to make the applications complying with the FCC's spectrum mask regulations at the transmitter paths, and to improve signal selectivity and receiving sensitivity at the receiver paths. Mos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ac2318db6b5ae4c251fac4f77002f74
https://doi.org/10.1109/mwsym.2009.5165882
https://doi.org/10.1109/mwsym.2009.5165882
Publikováno v:
2009 59th Electronic Components and Technology Conference.
A small form-factor balanced filter for WiMAX applications is developed using silicon-based IPD technology. The balanced filter (1.2mm × 2.0mm × 0.4mm for flip-chip version, and 1.2mm × 1.6mm × 0.25mm for wire-bonding version) is the smallest dev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0258712ed2fa6a16fa388e3541c6ada
https://doi.org/10.1109/ectc.2009.5074228
https://doi.org/10.1109/ectc.2009.5074228
Publikováno v:
2008 IEEE MTT-S International Microwave Symposium Digest.
In most of wireless communication systems, especially the front end modules, there are baluns connecting active circuits (e.g., PA and LNA) . Commercially available baluns are made in some fixed impedance ratios (50:50 ohm, 50:100 ohm, etc.), which u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3dfc5749c2a9a99a08320c030442f2fb
https://doi.org/10.1109/mwsym.2008.4633283
https://doi.org/10.1109/mwsym.2008.4633283
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Band-pass-filters (BPF) and baluns are critical components in the RF channels. Conventional discrete component solutions, like those from LTCC technology, use separate parts for these two functions. As miniaturization is becoming a trend for cost-red
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2907db055aaeeda14229c55ee417b160
https://doi.org/10.1109/ectc.2008.4550052
https://doi.org/10.1109/ectc.2008.4550052