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pro vyhledávání: '"Roger D. St. Amand"'
Publikováno v:
2009 59th Electronic Components and Technology Conference.
The current standard for flipchip encapsulantion is a two step process. Following flipchip attach, a liquid underfill material is dispensed along the die edge and allowed to flow, via adhesive capillary force, through the gap between the flipchip die
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cafaf1ce0821d5f98e07eeea467c692b
https://doi.org/10.1109/ectc.2009.5074128
https://doi.org/10.1109/ectc.2009.5074128
