Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Roger Bischofberger"'
Publikováno v:
Sensors and Actuators A: Physical. 110:93-97
In this paper,we present an inductive proximity sensor with fully integrated electronics. The sensor with the compact hybrid configuration is composed of a sensing flat coil and an integrated electronic interface. We focused during the development on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26827c403445fd1015034e578a2be097
https://doi.org/10.1016/j.sna.2003.07.007
https://doi.org/10.1016/j.sna.2003.07.007
Publikováno v:
Sensors and Actuators A: Physical. 61:392-399
A low-cost HARMS (High Aspect Ratio MicroSystems) process has been developed, which enables the fabrication of micromechanical parts or entire systems of metal. In comparison with the original LIGA process, this process is a truly low-cost one. Based
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c8195987e77cc924d135682b08c5adf
https://doi.org/10.1016/s0924-4247(97)80295-6
https://doi.org/10.1016/s0924-4247(97)80295-6
Autor:
Karen S. L. Chong, Christian Dais, Li Wang, Yeong Yuh Lee, Francis Clube, Christian David, Roger Bischofberger, Harun H. Solak, Istvan Mohacsi, Chang-Sheng Lee
Publikováno v:
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 34:061804
Nanoimprint molds are traditionally made from silicon. Silicon molds suffer from distinct disadvantages as they are brittle, prone to damage, scratch easily, and can only be used in a planar format. This has limited their use in higher throughput sys
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40ecc5e3c145f4b2d23efbadc5780cf6
https://doi.org/10.1116/1.4967696
https://doi.org/10.1116/1.4967696
Autor:
Chang-Sheng Lee, Yeong-Yuh Lee, Chong, Karen S. L., Li Wang, Dais, Christian, Clube, Francis, Solak, Harun H., Mohacsi, Istvan, David, Christian, Bischofberger, Roger
Publikováno v:
Journal of Vacuum Science & Technology: Part B-Nanotechnology & Microelectronics; Nov/Dec2016, Vol. 34 Issue 6, p061804-1-061804-5, 5p
Publikováno v:
Applied Physics Letters; 11/22/2004, Vol. 85 Issue 21, p4989-4991, 3p, 4 Diagrams
Publikováno v:
Journal of Micromechanics & Microengineering; Jun2015, Vol. 25 Issue 6, p1-1, 1p
Autor:
Jun Zhang, Hong Hua Tan
Selected, peer reviewed papers from the 2013 2nd International Symposium on Manufacturing Systems Engineering (ISMSE 2013), July 27-29, 2013, Singapore
