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pro vyhledávání: '"Rodsavas, S."'
Autor:
Maclean, Jessica O., Hodson, J.R., Tangkijcharoenchai, C., Al-Ojaili, S., Rodsavas, S., Coomber, S., Voisey, K.T.
The laser microdrilling of via holes in Si semiconductor wafers was studied using 1 ms pulses from an Yb fibre laser with 1070 nm wavelength. Optical microscopy and cross‑sectional analysis were used to quantify hole dimensions, the distribution of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::4aace3f93571af3992778a6c84943e02
