Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Robin Mair"'
Publikováno v:
2022 China Semiconductor Technology International Conference (CSTIC).
Autor:
Manjusha Mehendale, Andy Antonelli, Robin Mair, Priya Mukundhan, Janusz Bogdanowicz, Victor Blanco, Anne-Laure Charley, Philippe Leray
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Autor:
Robin Mair, G. Andrew Antonelli, Manjusha Mehendale, Priya Mukundhan, Beth May, Karen Terry, Nathaniel Brandt, Xiaoyue Phillip Huang, Tong Zhao
Publikováno v:
2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Autor:
Priya Mukundhan, Robin Mair, Manjusha Mehendale, Calvin Wang, Ewen Wang, Johnny Dai, Cheolkyu Kim
Publikováno v:
2020 China Semiconductor Technology International Conference (CSTIC).
Amorphous carbon (a-C) based hard masks provide superior etch selectivity, chemical inertness, are mechanically strong, and have been used for etching deep, high aspect ratio features that conventional photoresists cannot withstand. Picosecond Ultras
Autor:
R. Hollman, Manjusha Mehendale, M. Alves, Michael Kotelyanskii, K. Best, Priya Mukundhan, J. Dai, Robin Mair
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
Solder-based fine pitch microbumps along with through silicon vias (TSV) enable high density interconnects for die-to-die and die-to-wafer stacking for different applications. With reduction in bump dimensions, several challenges arise that need to b
Autor:
J. Chen, Priya Mukundhan, J. Dai, Manjusha Mehendale, Robin Mair, Michael Kotelyanskii, Todd W. Murray
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
The continuing shift to 3D integration requires formation of electrical interconnects between multiple vertically stacked Si devices to enable high speed, high bandwidth connections. Microbumps and through silicon vias (TSV) enable the high-density i
Autor:
Johnny Dai, Tim Kryman, Robin Mair, Priya Mukundhan, Kwansoon Park, Cheolkyu Kim, Xinglin Zeng
Publikováno v:
2018 China Semiconductor Technology International Conference (CSTIC).
Picosecond Ultrasonics (PULSE™) is a rapid, non-contact, non-destructive first principles acoustic metrology technique for in-line metal film thickness measurements. We demonstrate measurement capability for transparent and semi-transparent films,
Autor:
Xueping Ru, Andrew Bakir, Michael Kotelyanskii, Jonathan Cohen, Manjusha Mehendale, Michelle T. Schulberg, Priya Mukundhan, Robin Mair, David M. Stobbe, Todd W. Murray, T. Kryman
Publikováno v:
International Symposium on Microelectronics. 2015:000486-000492
The drive to reduce the interconnect pitch and increase the number of connections for packaging in mobile devices has led to the development of copper pillar bumps. The key drivers for the adoption of copper pillars are improved performance, reduced
Autor:
Eric Beyne, Priya Mukundhan, M. Liebens, Andy Miller, Manjusha Mehendale, Michael Kotelyanskii, X. Ru, Todd W. Murray, Robin Mair, S. Van Huylenbroeck, T. Kryman, L. Haensel
Publikováno v:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Through Silicon Via (TSV) technology represents one key aspect of 3D integration. International Technology Roadmap for Semiconductors (ITRS) has identified a need for an in-line metrology for characterizing voids in TSV structures. We have previously
Autor:
Robin Mair
Publikováno v:
Journal of Database Marketing & Customer Strategy Management. 13:116-121