Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Roberto, Ugioli"'
Autor:
Francesco Angione, Davide Appello, Paolo Bernardi, Andrea Calabrese, Stefano Quer, Matteo Sonza Reorda, Vincenzo Tancorre, Roberto Ugioli
Publikováno v:
IEEE Access, Vol 11, Pp 105655-105676 (2023)
Complexity and performance of Automotive System-on-Chips have exponentially grown in the last decade, also according to technology advancements. Unfortunately, this trend directly and profoundly impacts modern Electronic Design Automation tools, whic
Externí odkaz:
https://doaj.org/article/9244e0d26ba34deb87305d31412fe007
Autor:
Francesco Angione, Davide Appello, Paolo Bernardi, Claudia Bertani, Giovambattista Gallo, Stefano Littardi, Giorgio Pollaccia, Walter Ruggeri, Matteo Sonza Reorda, Vincenzo Tancorre, Roberto Ugioli
Publikováno v:
IEEE Transactions on Computers. 72:1447-1459
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::de5511a488ec2bea68f330cbb1ef58fa
https://doi.org/10.1109/tc.2022.3199994
https://doi.org/10.1109/tc.2022.3199994
Autor:
Angione, Francesco, Bernardi, Paolo, Calabrese, Andrea, Cardone, Lorenzo, Alessandro, Niccoletti, Piumatti, Davide, Quer, Stefano, Davide, Appello, Vincenzo, Tancorre, Roberto, Ugioli
Publikováno v:
2022 IEEE International Test Conference (ITC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4320519f1953b66af1213c54a33cb06a
https://doi.org/10.1109/itc50671.2022.00044
https://doi.org/10.1109/itc50671.2022.00044
Autor:
Angione, Francesco, Bernardi, Paolo, Filipponi, Gabriele, SONZA REORDA, Matteo, Davide, Appello, Vincenzo, Tancorre, Roberto, Ugioli
Publikováno v:
2022 IEEE European Test Symposium (ETS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::85eafd84a3fa08b550b0d1beff1ea0b8
https://doi.org/10.1109/ets54262.2022.9810396
https://doi.org/10.1109/ets54262.2022.9810396
Autor:
Giorgio Pollaccia, Claudia Bertani, Stefano Littardi, Roberto Ugioli, D. Appello, Walter Ruggeri, Matteo Sonza Reorda, V. Tancorre, Paolo Bernardi
Publikováno v:
DTIS
Burn-In equipment provide both external and internal stress to the device under test. External stress, such as thermal stress, is provided by a climatic chamber or by socket-level local temperature forcing tools, and aims at aging the circuit materia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4889dc4db638329f71fc31530b314195
https://doi.org/10.1109/dtis53253.2021.9505067
https://doi.org/10.1109/dtis53253.2021.9505067
Autor:
Roberto Ugioli, Paolo Bernardi, S. Quer, S. Littardi, Giorgio Pollaccia, D. Appello, V. Tancorre, A. Calabrese
Publikováno v:
DDECS
With the explosion of off-the-shelf SoCs in terms of size and the advent of novel techniques related to failure modes, commercial ATPG and fault simulation engines can often be insufficient to measure the coverage of very specific metrics. In these c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::384500985511f3510f271aa95d5f8409
http://hdl.handle.net/11583/2909176
http://hdl.handle.net/11583/2909176
Autor:
Giorgio Pollaccia, M. Restifo, Paolo Bernardi, D. Appello, V. Tancorre, Giulio Zoppi, F. Almeida, M. Sonza Reorda, D. Calabrese, Roberto Ugioli
Publikováno v:
DDECS
Automotive systems must reach a high reliability in their electronic components. This kind of devices must undergo several tests and stress steps discovering all possible defects that could manifest during lifetime. Burn-In (BI) is a manufacturing te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fbb3fc23199c690eb0ce9d8c90b024fc
https://doi.org/10.1109/ddecs.2019.8724644
https://doi.org/10.1109/ddecs.2019.8724644