Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Robert Süß-Wolf"'
Autor:
Moritz Meiners, Florian Hefner, Paul Heisler, Matthias Friedlein, Jörg Franke, Simon Frohlig, Niklas Piechulek, Lorenz Schmidt, Robert Süß-Wolf, Jan Frohlich, Marlene Kuhn Huong Nguyen, Li Wang
Publikováno v:
2020 10th International Electric Drives Production Conference (EDPC).
Since the automotive wiring harness interconnects all electrical components in a vehicle, it also must adapt to all componential, mechanical, and electrical architecture changes. For this reason, almost all trends that affect the vehicle in general a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae48bf775b7fe0c8595fa5dbb48bfe2e
https://doi.org/10.1109/edpc51184.2020.9388180
https://doi.org/10.1109/edpc51184.2020.9388180
Publikováno v:
2020 IEEE 11th International Conference on Mechanical and Intelligent Manufacturing Technologies (ICMIMT).
The recent trends in the automotive sector are challenging the manufacturers of wire harnesses. Automation, connectivity, and electrification are the key developments for a future car which should on one hand run autonomous and on the other hand have
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7eeb0e9a5984cbc12f933f934221081e
https://doi.org/10.1109/icmimt49010.2020.9041165
https://doi.org/10.1109/icmimt49010.2020.9041165
Publikováno v:
Production at the leading edge of technology ISBN: 9783662604168
The solderless wrapping process is an electrical connection technology. It is mainly used in applications which require high reliability, such as the aerospace industry. A single solid conductor is wrapped around a connecting terminal. The process is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b142e7baa9bf924594adcbb82723e700
https://doi.org/10.1007/978-3-662-60417-5_43
https://doi.org/10.1007/978-3-662-60417-5_43
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 89:1591-1602
The molded interconnected devices (MID) technology is vastly growing as an important innovative technology in the field of electronics production. The laser direct structuring (LDS) method is one of the most common available technologies for building
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e9a35bc0385183adc8f9b0c2784cba5
https://doi.org/10.1007/s00170-016-9173-4
https://doi.org/10.1007/s00170-016-9173-4
Publikováno v:
Journal of Laser Applications. 32:042013
Laser selective metallization of ceramics (LMC) has been widely applied to prepare high-quality electrical patterns on ceramic circuit carriers. As the dominating factor, surface roughness after laser treatment is controlled mostly by the laser techn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9ffa2ba77ec325f5ebfad715df5ab7c
https://doi.org/10.2351/7.0000198
https://doi.org/10.2351/7.0000198
Publikováno v:
Journal of Laser Applications. 30:022006
The enormous applications of the molded interconnect devices (MID) make these face many difficult challenges, some of which are the quality and the reliability, as well as concerns on how to produce the micro-MID products. This drives to a hard compe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04906e7c05518e197c6c56f7ad0c6495
https://doi.org/10.2351/1.5005629
https://doi.org/10.2351/1.5005629
Autor:
Zongwen Fu, Bassim Bachy, Nahum Travitzky, Li Wang, Robert Süß-Wolf, Peter Greil, Jörg Franke
Publikováno v:
Advanced Engineering Materials. 20:1700824
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::695ad852ddb6969ef5c3826094ee3fdf
https://doi.org/10.1002/adem.201700824
https://doi.org/10.1002/adem.201700824