Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Robert Rhoades"'
Publikováno v:
J Clin Aesthet Dermatol
The choice of vehicle is an important consideration in the treatment of acne and rosacea. Agents used to treat these common conditions may be limited by multiple factors, including poor stability during storage, limited residence time in the skin and
Autor:
Robert Rhoades, Rashid Mavliev
Publikováno v:
2020 International Wafer Level Packaging Conference (IWLPC).
Interconnects are one of the most difficult steps in the manufacturing process, particularly at advanced process nodes with more metal layers to connect, both internally and externally. The Cu damascene process is widely applied in BEOL of IC industr
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Thin film deposition of metals is necessary in the fabrication sequence of most electronic devices, but much of the deposited metal is actually wasted in the subsequent patterning steps. In the case of copper interconnects for advanced semiconductor
Publikováno v:
Physical review. E. 101(4-1)
We study a variation of the trapping reaction, A+B->A, in which both the traps (A) and the particles (B) undergo diffusion, and the traps upon meeting react according to A+A->0 or A. This two-species reaction-diffusion system is known to exhibit a no
Autor:
Robert Rhoades
Publikováno v:
ECS Meeting Abstracts. :805-805
The technology of chemical mechanical polishing (CMP) continues to evolve in multiple dimensions. As one of the key enabling processes for advanced digital devices, such as microprocessors and high-speed memory, CMP is expected to deliver surfaces th
Publikováno v:
Ramanujan 125. :91-102
Autor:
Robert Rhoades
Publikováno v:
Journal of Ethnobiology. 25:145-148
Publikováno v:
2010 IEEE International Interconnect Technology Conference.
A process sequence has been developed and characterized to fabricate interconnect structures in MEMS devices capable of withstanding thermal cycles up to at least 700°C. Via test structures with 3–7 µm diameter and 5–10 µm depth were etched in
Publikováno v:
ASME 2010 First Global Congress on NanoEngineering for Medicine and Biology.
We are investigating silicon-based platforms for detection and analysis of breast cancer cells. Attachment and spreading of MDA-MB-231 human metastatic breast cancer cells was compared to that of non-tumorigenic human breast epithelial cells, MCF-10A
Autor:
Robert Rhoades, Dorota Temple, Trevor Knutson, Christopher Gregory, Yun Zhang, Dean Malta, Thomas Richardson, Chen Wang
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
The fabrication of through-silicon vias (TSVs) is a major component in the development of three-dimensional (3D) integration technology and advanced 3D packaging approaches. The large diameter and length of TSVs, as compared to traditional interconne