Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Robert P. Rippstein"'
Publikováno v:
IBM Journal of Research and Development. 37:395-410
In 1991 a storage ring designed as a source of X-rays for X-ray lithography was delivered, installed, and commissioned in the IBM Advanced Lithography Facility (ALF) in East Fishkill, New York. Beamlines of two different designs have been constructed
Autor:
Alex L. Flamholz, Inna V. Babich, Juan R. Maldonado, Vincent Dimilia, Robert P. Rippstein, L. C. Hsia
Publikováno v:
Microelectronic Engineering. 21:113-116
This paper describes techniques to determine the effective wavelength of x-ray lithography sources. The experimental results give information on the actual x-ray absorption of the resist materials for the x-ray source under test. Results for two beam
Autor:
Robert P. Rippstein, Cameron J. Brooks, Michael J. Lercel, Shalom J. Wind, Azalia A. Krasnoperova, Alex L. Flamholz, E. Kratschmer
Publikováno v:
SPIE Proceedings.
This paper discusses the resolution capabilities of proximity x-ray lithography (PXRL) system. Exposure characteristics of features designed at 150 nm pitch size: 75 nm dense lines with 1:1 duty ratio, 2D features at 1:1 and 1:2 duty ratios and isola
Publikováno v:
SPIE Proceedings.
In this paper, dimensional control of critical features in proximity x-ray lithography is discussed. CD error components attributed to x-ray mask, proximity exposure and resist process are identified. Analysis of linewidth control data at 180 nm and
Autor:
R. J. Amodeo, Ben R. Vampatella, George A. Gomba, Alex L. Flamholz, Carl Stahlhammer, D. A. Heald, Azalia A. Krasnoperova, P. C. Kochersperger, Robert H. Fair, J. P. Silverman, William Chu, Alek C. Chen, Vincent Dimilia, Robert P. Rippstein
Publikováno v:
SPIE Proceedings.
A state-of-the-art proximity x-ray lithography aligner was developed for the Defense Advanced Lithography Program (DALP) and installed in IBM's Advanced Lithography Facility (ALF) in 1995. This aligner was designed to satisfy the manufacturing requir
Autor:
Robert P. Rippstein, Raymond Robert Ruckel, John C. Granlund, Alfred E. Palumbo, James M. Oberschmidt, Alek C. Chen
Publikováno v:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing II.
X-ray lithography using a synchrotron light source has received considerable attention in recent years as a method for producing semiconductor device dimensions smaller than 0.35 microns. A number of synchrotrons or Electron Storage Rings (ESR) have
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 15:2476
The 180 nm ground rule production prototype x-ray lithography aligner was developed for the Defense Advanced Lithography Program (DALP) and installed in IBM’s Advanced Lithography Facility (ALF) in 1995. This aligner is designed to satisfy the manu
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 12:4018
In proximity x‐ray lithography (XRL), two types of illumination are used: full field and scanning. We describe a single mirror condenser for XRL beam lines which provides a high flux of soft x rays. The surface is generally aspheric, designed using
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 11:2976
An x‐ray flux delivery system consisting of a compact storage ring and dedicated beamlines is now in routine use in the IBM Advanced Lithography Facility in East Fishkill, New York. The beamlines have been designed for use with a stepper that scans
Autor:
Robert P. Rippstein, Alex L. Flamholz
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 8:2002
An integrated x‐ray align and expose system has been installed at Brookhaven National Laboratory National Synchrotron Light Source VUV beam line U2. The system includes the first commercially available x‐ray align and expose system, the Karl Suss