Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Robert Lugg"'
Autor:
Liang Zhu, Robert Lugg
Publikováno v:
ECS Transactions. 44:267-274
Typical IC layouts are simple shapes such as rectangles and 45 degree triangles. However, the high-spatial-frequency components of the mask spectrum cut off by the low-pass pupil will result in the rounded images and pattern distortions. Although opt
Autor:
Robert Lugg
Publikováno v:
Interdisciplinary Studies in Literature and Environment. 23:468-469
Publikováno v:
SPIE Proceedings.
Model based optical proximity correction (MB-OPC) has been widely used in advanced lithography process today. However controlling the edge placement error (EPE) and critical dimension (CD) has become harder as the k1 process factor decreases and desi
Autor:
Matt St. John, Yasushi Kojima, Randall Brown, Sooryong Lee, Xiaohai Li, Hironobu Taoka, Akemi Moniwa, Robert Lugg, Yang Ping
Publikováno v:
SPIE Proceedings.
In this paper, we present some important improvements on our process window aware OPC (PWA-OPC). First, a CDbased process window checking is developed to find all pinching and bridging errors; Secondly, a rank ordering method is constructed to do pro
Autor:
Joo-Tae Moon, Kyoil Koo, Woo-Sung Han, Sung-Gon Jung, Sung-Woon Choi, Young-Chang Kim, Suk-Joo Lee, Xiaohai Li, Sooryong Lee, Frank Amoroso, Sang-Wook Kim, Benjamin D. Painter, Levi D. Barnes, Munhoe Do, Sungsoo Suh, Robert Lugg
Publikováno v:
SPIE Proceedings.
Due to shrinking design nodes and to some limitations of scanners, extreme off-axis illumination (OAI) required and its use and implementation of assist features (AF) to solve depth of focus (DOF) problems for isolated features and specific pitch reg
Autor:
Matt St. John, Jung-Hoe Choi, Jason Hwang, Young-Chang Kim, Kyoil Koo, Robert Lugg, Seung-Hee Baek, Munhoe Do, Sooryong Lee, Minjong Hong, Daniel F. Beale
Publikováno v:
SPIE Proceedings.
Although the mask pattern created by fine ebeam writing is four times larger than the wafer pattern, the mask proximity effect from ebeam scattering and etch is not negligible. This mask proximity effect causes mask-CD errors and consequently wafer-C
Autor:
Sungsoo Suh, Suk-Joo Lee, Tae-Hyuk Ahn, Robert Lugg, Woo-Seok Shim, Jung-Hyeon Lee, Chang-Jin Kang, Seok-Hwan Oh, Sooryong Lee, Frank Amoroso
Publikováno v:
SPIE Proceedings.
Many issues need to be overcome in creating a production-worthy sub-k1 (
Publikováno v:
SPIE Proceedings.
In the past technology generations, Optical Proximity Correction (OPC) has been applied using a model capturing the Optical proximity effects in a single focal plane. In the newer generations, this method is more and more difficult to maintain becaus
Autor:
Kunal N. Taravade, Levi D. Barnes, Jeff Mayhew, Kevin Lucas, Robert Lugg, Ben Painter, Glenn Newell
Publikováno v:
SPIE Proceedings.
The upcoming 45nm and 32nm device generations will continue the familiar industry lithography trends of decreased production K1 factor, reduced focus error tolerances and increased pattern density. As previous experience has shown, small changes in t
Autor:
Robert Lugg, James P. Shiely, Rick Farnbach, Mike Rieger, Dave Gerold, Matt St. John, Randy Brown, Kevin Lucas, Josh Tuttle
Publikováno v:
SPIE Proceedings.
The upcoming 45nm device node is a point at which newer field-based (i.e., dense pixel-based) OPC simulation methods may begin to show advantages over sparse-sampling ("flash") simulation methods. Field-based simulation provides computational efficie