Zobrazeno 1 - 10
of 36
pro vyhledávání: '"Robert Lanzone"'
Autor:
KwangSeok Oh, Jemmy Sutanto, Juhoon Yoon, Robert Lanzone, Ron Huemoeller, DaeByoung Kang, Michael Oh
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000916-000936
This paper describes the ongoing 3 years research and development at Amkor Technology on CoC (Chip on Chip)/FtF (Face to Face) – PossumTM technology. This technology has showed a lot of interests from the microelectronics customers/industries becau
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c29481ac48c48ba17e16e84d0555ae9b
https://doi.org/10.4071/2013dpc-tp33
https://doi.org/10.4071/2013dpc-tp33
Autor:
KwangSeok Oh, DaeByoung Kang, Robert Lanzone, KyungRok Park, S. Y. Ma, Michael Oh, Juhoon Yoon, Ron Huemoeller, J. Sutanto
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper describes the ongoing research and development at Amkor Technology of Chip-on-chip/Face to Face (CoC/F2F) technology being developed in parallel with Through Silicon Via (TSV) package assembly. Unlike other 3D packaging techniques using TS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7197b8218e99dfda72e1dff6237674e
https://doi.org/10.1109/ectc.2013.6575690
https://doi.org/10.1109/ectc.2013.6575690
Autor:
Robert Lanzone
Publikováno v:
Advanced Flip Chip Packaging ISBN: 9781441957672
Flip chip, as the name implies, is a means of chip assembly whereby the chip is attached face down (active Integrated Circuit (IC) side down) to the substrate. Flip chip technology was invented by IBM in 1961 and is now 51 years old. This development
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16ffb2c0e4d0b00b0d2f147e88123b5e
https://doi.org/10.1007/978-1-4419-5768-9_1
https://doi.org/10.1007/978-1-4419-5768-9_1
Autor:
Curtis Zwenger, Shawn O'Connor, Min Yoo, C. Beddingfield, Robert Lanzone, KyungRok Park, DaeByoung Kang, Mark A. Gerber, Robert Francis Darveaux, Sung-Su Park, MinJae Lee
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
There has been a growing need for fine pitch flip chip technology in support of next generation communication devices with increasing die complexities. The increase in functionality which drives a larger number of signal I/O's in combination with sma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::668c0cff4c96ac0b6290307c87ea8358
https://doi.org/10.1109/ectc.2011.5898576
https://doi.org/10.1109/ectc.2011.5898576
Autor:
Choonheung Lee, DaeByoung Kang, Min Yoo, Jihee Cho, Robert Lanzone, Jaedong Kim, Curtis Zwenger, MinJae Lee, Seungki Lee
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Today, flip chip technology is a main stream of interconnection in microelectronic packaging and market forces continue to drive toward finer pitch interconnections. In this paper, fine pitch flip chip (FPFC) interconnection technology (i.e., less th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0ef4cfacc8be25c4b71fe0919dade63
https://doi.org/10.1109/ectc.2009.5074092
https://doi.org/10.1109/ectc.2009.5074092
Publikováno v:
Area Array Interconnection Handbook ISBN: 9781461355298
During the 1990s, Ceramic Ball Grid Array (CBGA) and Ceramic Column Grid Array (CCGA) packages moved from development laboratories [1] to volume factory production [2]. The steady growth in the use of these packages has been driven by many factors th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bad1eb63473baeb40faf2759660b848d
https://doi.org/10.1007/978-1-4615-1389-6_17
https://doi.org/10.1007/978-1-4615-1389-6_17
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