Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Robert Klengel"'
Autor:
Robert Klengel, Sandy Klengel, Sebastian Tismer, Thomas Ackermann, Noritoshi Araki, Motoki Eto, Teruo Haibara, Takashi Yamada, Jochen Feldmann, Ralph Binner, Henk Peters, Achim Scheer, Vincent Chee
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c81eb9395612d9f2b5f452090ea5b8d2
https://doi.org/10.1109/ectc51906.2022.00083
https://doi.org/10.1109/ectc51906.2022.00083
Autor:
Teruo Haibara, Takashi Yamada, Robert Klengel, Noritoshi Araki, Jan Schischka, Motoki Eto, Sandy Klengel
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Silver (Ag) bonding wires are mainly used in consumer products as a reliable low-cost alternative to gold (Au) bonding wires. In automotive applications, the materials are exposed to particularly harsh environmental conditions. In order to understand
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1319e2f176c1888100a8eaefd2845d72
https://doi.org/10.23919/empc53418.2021.9584956
https://doi.org/10.23919/empc53418.2021.9584956
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Corrosion occurs on metallic materials in the presence of moisture and reactive gases, such as H 2 S, SO 2 or NO 2 and is enhanced by different substances like e.g. chlorides. Particularly electronic materials and components are affected, because the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e50158cb777ae0e12b0cb7ca65535ce
https://doi.org/10.23919/empc53418.2021.9584943
https://doi.org/10.23919/empc53418.2021.9584943
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
By today, die bonding on flexible circuit boards is only possible with adhesive connections or can be realized in combination by rigid-flex technology via soldering. The flex technology has a big potential with regard to new application fields such a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b655cbcb905c214c708e4e784f62b3d4
https://doi.org/10.1109/ectc32696.2021.00278
https://doi.org/10.1109/ectc32696.2021.00278
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
During the past ten years, copper (Cu) bond wires have increasingly replaced gold (Au) wire materials. While this development began in the consumer electronics sector, Cu wires are now increasingly advancing into applications with challenging environ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5901eb17b34dcf4c39636a03facbb76e
https://doi.org/10.1109/estc48849.2020.9229707
https://doi.org/10.1109/estc48849.2020.9229707
Autor:
Robert Klengel, Takashi Yamada, Tino Stephan, Motoki Eto, Jan Schischka, Sandy Klengel, Matthias Petzold, Noritoshi Araki
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
During the past ten years, copper (Cu) bond wires have extensively replaced gold (Au) wire materials. While this development began in the consumer electronics sector, Cu wires are now increasingly advancing into applications with challenging environm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ad718207d903011adb762fed7d08def
https://doi.org/10.1109/ectc32862.2020.00127
https://doi.org/10.1109/ectc32862.2020.00127
Autor:
Tino Stephan, Jan Schischka, Robert Klengel, Noritoshi Araki, Sandy Klengel, Matthias Petzold, Motoki Eto, Takashi Yamada
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
We present studies for a newly developed gold-palladium coated copper wire with focus to the automotive industry. This wire material was designed to prevent halide induced interface corrosion and also sulphur induced pitting corrosion. The base mater
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0babcc02aad4b63c08abe66fe077767
https://doi.org/10.23919/empc44848.2019.8951812
https://doi.org/10.23919/empc44848.2019.8951812
Autor:
Falk Naumann, Sandy Klengel, Matthias Petzold, Motoki Eto, Takashi Yamada, Georg Lorenz, Robert Klengel, Noritoshi Araki
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this study we present a newly developed gold-palladium coated copper (EX1R) wire with focus on automotive industry. By using an advanced material composition, halide induced interface corrosion and also sulphur induced pitting corrosion can be pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a783b7fb3598ba8d883aeca4130c2790
https://doi.org/10.23919/empc44848.2019.8951874
https://doi.org/10.23919/empc44848.2019.8951874
Autor:
Robert Klengel, Jan Schischka, Tino Stephan, Matthias Petzold, Takashi Yamada, Sandy Klengel, Motoki Eto, Noritoshi Araki
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this paper, we present studies for the new gold-palladium coated copper wire "EX1R" with focus to application in the automotive industry. This wire material was developed to prevent halide induced interface corrosion and also sulfur induced pittin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::143eb2c2033a2b44a70f14f6164fecbd
https://doi.org/10.1109/ectc.2019.00034
https://doi.org/10.1109/ectc.2019.00034
Autor:
Noritoshi Araki, Takashi Yamada, Satoshi Fujimoto, Matthias Petzold, Motoki Eto, Robert Klengel, Sandy Klengel, Masaaki Sugiyama
Publikováno v:
Microelectronics Reliability. 114:113819
Recently, a shift from Au bonding wire to Cu bonding wire is expected for automotive application. Palladium coated copper (PCC) wire is strong candidate since it is widely used in LSI packages owing to its high performance and low cost. In order to a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c7d6d9431d7fd100c4a7caaa7d354dc4
https://doi.org/10.1016/j.microrel.2020.113819
https://doi.org/10.1016/j.microrel.2020.113819