Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Robert Illing"'
Autor:
Werner Robl, Sven Gustav Lanzerstorfer, Stefan Decker, Markus Ladurner, Thomas Detzel, Stefan Wöhlert, Bernhard Auer, Michael Rogalli, Robert Illing, Michael Nelhiebel, J. Fugger
Publikováno v:
Microelectronics Reliability. 53:1745-1749
Electric overload situations in automotive truck applications necessitate a particularly efficient and reliable heat management for silicon power devices, especially when repetitive events must be handled. We show by simulations and experiments that
Autor:
Helmut Kock, Michael Nelhiebel, Markus Ladurner, Robert Illing, Michael Glavanovics, Christian Djelassi, Stefano de Filippis, Dionyz Pogany
Publikováno v:
Microelectronics Reliability. 51:1913-1918
This paper focuses on optimization of bond wire positions as a method to improve thermal management of power semiconductors. For this purpose, robustness of a new low-voltage MOSFET generation with an optimized multiple bond wire arrangement and devi
Autor:
T. Herzig, Christoph Schreiber, Christoph Kadow, Donald Dibra, Michael Nelhiebel, M. Inselsbacher, Michael Glavanovics, Sylvain Fraïssé, Stefan Wöhlert, Robert Illing, Markus Ladurner, Sven Gustav Lanzerstorfer, Stefan Decker, Michael Rogalli, M. Poschgan, Werner Robl, H. Unterwalcher
Publikováno v:
Microelectronics Reliability. 51:1927-1932
We demonstrate that by novel technology concepts, silicon devices can handle electrical power pulses millions of times without failure, although peak temperatures in the silicon reach 350 °C during every cycle. This was made possible by a robust tre
Publikováno v:
Microelectronics Journal. 41:889-896
The relevance of thermally non-linear silicon material models for transient thermal FEM simulations of smart power switches (SPS) is proved by a power silicon test device consisting of two power transistors and eleven integrated temperature sensors d
Autor:
Helmut Kock, Stefan Decker, Stefano de Filippis, Michael Nelhiebel, Andrea Irace, Robert Illing
Publikováno v:
2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD).
Power MOSFETs integrated in modern Smart Power switches feature a substantial high current capability due to the very low value of their transconductance coefficient K. In this paper we demonstrate that the trend related to the increasing current cap
Autor:
Donald Dibra, Thomas Ostermann, Helmut Kock, Dionyz Pogany, Stefan Decker, Gregor Pobegen, Stefano de Filippis, Michael Glavanovics, Robert Illing
Publikováno v:
2011 IEEE ICMTS International Conference on Microelectronic Test Structures.
A test chip with the purpose of thermal monitoring and analysis is implemented in a common-drain smart power trench MOSFET technology. For accurate evaluation of the junction temperature, small embedded sensor structures are introduced. One sensor is
Publikováno v:
BMAS
This paper presents a method for the compact modeling, simulation and experimental verification of digital protection functions of smart power switches consisting of a digital controller and a power MOSFET with analog driving circuitry. We focus on s
Autor:
Robert Illing
Publikováno v:
Music and Letters. 78:143-143
Publikováno v:
Australian Academic & Research Libraries. 20:121-128
Autor:
Robert Illing
Publikováno v:
Music and Letters. :219-223