Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Robert Hsieh"'
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Growth in the usage of heterogenous integration and chiplets-based designs in modern advanced packages for leading applications like AI and HPC is driving the need for very large chip sizes that exceed the dimensions of a single back-end stepper expo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::927770d465b8e1aa8940c8758c6aedd6
https://doi.org/10.1109/ectc32696.2021.00321
https://doi.org/10.1109/ectc32696.2021.00321
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Wafer-level packaging with high density fan-out (HDFO) requires multiple redistribution layers (RDL) to handle the high-density interconnections and the large data transfer rates between chips in the package. Decreasing the critical dimension (CD) of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d28c73578bba241778250a7175cea319
https://doi.org/10.1109/ectc32862.2020.00179
https://doi.org/10.1109/ectc32862.2020.00179
Autor:
Andy Miller, Akito Hiro, Romain Ridremont, John Slabbekoorn, Samuel Suhard, Robert Hsieh, Warren W. Flack, Ha-Ai Nguyen
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
This study investigates creation of $1.0 \mu \mathrm{m}$ RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is that the Cu overburden removal does no
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6169bd12f6aa5c0f286fbd515d9223c4
https://doi.org/10.1109/eptc.2018.8654363
https://doi.org/10.1109/eptc.2018.8654363
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Fan-Out wafer level packaging has seen rapid adoption over the last few years due to its form factor, performance, and cost advantages compared to 3D packaging techniques. Redistribution layers (RDL) are used to route the very high density connection
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8202099928c9d84ea4f5adaf2e7d8811
https://doi.org/10.1109/eptc.2017.8277536
https://doi.org/10.1109/eptc.2017.8277536
Peer-assisted video on-demand streaming system in practical WiFi-based mobile opportunistic networks
Publikováno v:
Journal of Network and Computer Applications. 37:33-44
Network convergence paradigm will substantially increase the pervasive use of WiFi-enabled mobile devices such as smart phones (e.g., Android-based mobile and iPhone), e-book viewers (e.g., iPad and Kindle) and personal media players. Although variou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89847bcc3651d5c45ceb071c389fcbca
https://doi.org/10.1016/j.jnca.2011.07.014
https://doi.org/10.1016/j.jnca.2011.07.014
Autor:
John Slabbekoorn, Bert Tobback, Andy Miller, Warren W. Flack, P. Czarnecki, Gareth Kenyon, Michele Stucchi, Stefaan Van Huylenbroeck, T. Vandeweyer, Robert Hsieh
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Foundry customers and makers of leading-edge devices are evaluating through-silicon via (TSV) for next-generation three-dimensional (3D) packaging. Scaling the diameter of the TSV is a major driver for improving system performance and cost. With smal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14edb796fc57e2f9bd0d4e0c0bf428b2
https://doi.org/10.1109/eptc.2016.7861543
https://doi.org/10.1109/eptc.2016.7861543
Autor:
John Slabbekoorn, Yi Cao, Chunwei Chen, Robert Hsieh, Warren W. Flack, Andy Miller, Gareth Kenyon, Ping-Hung Lu, Eric Beyne, Manish Ranjan, Medhat A. Toukhy
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Large area silicon or glass interposers may exceed the maximum imaging field of step and repeat lithography tools. This paper discusses the lithographic process used to create a large area interposer on a stepper by the combination of multiple subfie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e25a0b2fce11fdda5727cf1ae086de01
https://doi.org/10.1109/ectc.2014.6897262
https://doi.org/10.1109/ectc.2014.6897262
Publikováno v:
2011 IEEE 13th International Conference on e-Health Networking, Applications and Services.
Due to the advances made in sensing, computing and networking, continuous monitoring and just-in-time prevention through Wireless Body Area Network (WBAN) in healthcare becomes a promising approach. In order to support healthcare needs, WBAN must ach
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ad5a62435f2649fd4c35d861a70e6c3
https://doi.org/10.1109/health.2011.6026746
https://doi.org/10.1109/health.2011.6026746
Autor:
Khiem T. Nguyen, Nuno Silva, Paulo Cardoso, Eoin O Toole, Robert Hsieh, Gareth Kenyon, Manish Ranjan, Werner Robl, Warren W. Flack, Rainer Leuschner, Thorsten Meyer
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
The rapid growth of wireless consumer electronics products is driving demand for cost effective and small form factor packaging solutions. While front end silicon technologies have followed Moore's law by device scaling, the back end infrastructure h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72de898d10e380999ad695485931c573
https://doi.org/10.1109/ectc.2011.5898493
https://doi.org/10.1109/ectc.2011.5898493
Publikováno v:
2009 Fourth International Conference on Communications and Networking in China.
Content distribution from wired to wireless domain has traditionally being perceived as the problem of wireless last-hop extension. We argue that increasing the physical transmission capability at the last hop bottleneck alone will not be sufficient
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a19e1c467bd5fd95929bc78904171f10
https://doi.org/10.1109/chinacom.2009.5339866
https://doi.org/10.1109/chinacom.2009.5339866