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pro vyhledávání: '"Robert F. Teagle"'
Autor:
Anbu Selvam Km Mahalingam, Qian Ge, J.-B. Laloë, San Leong Liew, Mary Claire Silvestre, Alain Laval, Balajee Rajagopalan, Robert F. Teagle, Eswar Ramanathan, Nobuyuki Takahashi, Sohana Khanal
Publikováno v:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
The BEOL Barrier-Seed deposition process is a key component in achieving the desired electrical and electro-migration performance while balancing the step coverage. The process also has a multifold impact on wafer yield parametric since it serves mul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c171f5cc5531e1dd0b7472867e52055
https://doi.org/10.1109/asmc.2016.7491165
https://doi.org/10.1109/asmc.2016.7491165
Autor:
YuanChi Chiang, Erin Lavigne, HungYu Tien, Fei Wang, Derek Tomlinson, Frank W. Mont, Robert F. Teagle
Publikováno v:
25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).
As critical design rules continuously shrink to 10nm and beyond, and double patterning or multiple patterning become prevailing practice, detection of missing pattern prior to Chemical Mechanical Planarization (CMP) or the final etch level in Back En
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec4cbad0459814d06c067b072c9b2e66
https://doi.org/10.1109/asmc.2014.6847023
https://doi.org/10.1109/asmc.2014.6847023
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