Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Robert F. Miracky"'
Autor:
T. Rudwick, C. Galanakis, S. Madere, T. Hirsch, H. Muller, Robert F. Miracky, S. Sommerfeldt, H. Hashemi
Publikováno v:
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92.
The authors describe a rapid prototyping methodology for multichip modules, based upon laser processes for linking and cutting conductors. They discuss some of the design and test issues involved in this approach. Results are presented of efforts to
Autor:
A. Somadder, I. Yee, Robert F. Miracky, Jason D. Reed, Minchuan Wang, D. Cobb, G. Caldwell, Tom J. Hirsch, Brent D. Lunceford
Publikováno v:
Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).
We previously reported a demonstration of rapid MCM prototyping technology. This first generation supported wire bond assembly. Now, we report on extending the technology to support flip-chip attachment. Maskless laser-based processes for rerouting f
Autor:
Guy Caldwell, Tom J. Hirsch, Jason D. Reed, Deborah Cobb, Ian Yee, Robert F. Miracky, Minchuan Wang, Brent D. Lunceford, Anjan Somadder
Publikováno v:
SPIE Proceedings.
MCC has developed a rapid prototyping technology for manufacturing high density interconnections for multichip modules (MCMs). By using laser direct writing to customize a high density pre-manufactured programmable substrate, the time required to mak
Autor:
Scott C. Sommerfeldt, William Weigler, Tom J. Hirsch, Tom Rudwick, Robert F. Miracky, Seyed Hassan Hashemi, Heinrich G. Mueller
Publikováno v:
Rapid Thermal and Laser Processing.
We have applied laser direct-write processing techniques to the fabrication of "multichip modules" (MCMs), a next-generation advanced semiconductor packaging technology. To minimize the amount of laser processing which is required, we have created ne
Autor:
Claire T. Galanakis, Scott C. Sommerfeldt, Tom J. Hirsch, Robert F. Miracky, Heinrich G. Mueller
Publikováno v:
SPIE Proceedings.
A process for fast personalization of multi-chip modules has been developed. Multilayer substrates with an incomplete top layer are prefabricated. Substrates are personalized within a few hours, using a frequency doubled Nd:YAG laser. 50 ns pulses wi
Publikováno v:
Physical Review Letters. 50:856-859
The current-voltage characteristics of Josephson tunnel junctions shunted by a resistance with a substantial self-inductance exhibit stable negative-resistance regions. Very large increases in the low-frequency voltage noise with noise temperatures o
Publikováno v:
Physical Review A. 29:2102-2109
The method of harmonic balance is used to obtain analytic results for the differential equation describing a current-biased Josephson junction with self-capacitance that is shunted by a resistor with substantial self-inductance. This system is known
Publikováno v:
Geophysical Prospecting. 31:149-170
During the past 3 years, major advances in the magnetotelluric technique have improved the quality of magnetotelluric data to the point where random errors in the impedance tensor and tipper are generally smaller than the uncertainty in their interpr
Autor:
Robert F. Miracky, John Clarke
Publikováno v:
Applied Physics Letters. 43:508-510
Analog simulations of the three‐photon Josephson parametric amplifier indicate that the noise rise observed in experimental devices arises from occasional hopping between a mode at the pump frequency ωP and a mode at the half‐harmonic ωP/2 . Th
Autor:
Robert F. Miracky
Publikováno v:
MRS Proceedings. 129
Laser direct-write processes are attractive complements to traditional methods of fabricating microelectronic circuitry. This paper is a summary of our work in applying such processes to high-density inter-chip interconnection modules, such as those