Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Robert Daily"'
Autor:
Andy Miller, Kazuyuki Mitsukura, Robert Daily, Eric Beyne, Tomonori Minegishi, Teng Wang, Keiichi Hatakeyama, Kenneth June Rebibis, Ryouta Saisyo, Fabrice Duval, Tatsuya Makino
Publikováno v:
Journal of Photopolymer Science and Technology. 28:229-232
Autor:
Jaber Derakhshandeh, G. Beyer, Silvia Armini, Yannick Vandelaer, Luca Di Piazza, George Vakanas, Inge De Preter, Eric Beyne, Dries Dictus, Myriam Van De Peer, Lin Hou, Stefano Guerrieri, Kevin Vandersmissen, John Slabbekoorn, Kenneth June Rebibis, Robert Daily, A. Lesniewska, Andy Miller
Publikováno v:
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).
In this paper we report results and challenges of replacing Cu with Co as UBM (under bump metallization) in microbumps for 3D technology applications. Cobalt has softer and single IMC (intermetallic compounds) and according to calculations using Coba
Autor:
William Travis, Robert Daily, David M. Bevly, Kevin Knoedler, Reinhold Behringer, Hannes Hemetsberger, Jürgen Kogler, Wilfried Kubinger, Bram Alefs
Publikováno v:
Journal of Field Robotics. 23:579-597
Autor:
Robert Behringer, R. C. Addison Jr., Robert Daily, W. Guthmiller, David M. Bevly, Venkataraman Sundareswaran, C. Reinhart, J. de Marchi, B. Gregory, R. Elsley
Publikováno v:
IFAC Proceedings Volumes. 37:910-915
The Sci Autonics vehicles in the DARPA Grand Challenge employ a combination of Lidar and Radar sensors for far look-ahead distance and a suite of ultrasonic and optical sensors for short-range obstacle detection. A pinhole camera is used to detect vi
Autor:
A. La Manna, Robert Daily, L. Bogaerts, Andy Miller, J. De Vos, Giovanni Capuz, Eric Beyne, Kenneth June Rebibis
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
3D stacking is a relative new technology and presents numerous challenges that need to be addressed for enabling high volume manufacturing. Yield and reliability are strongly affected by typical 3D processes: TSV, wafer thinning, stacking. For 3D sta
Autor:
Wilfried Kubinger, Robert Behringer, Bram Alefs, Robert Daily, Hannes Hemetsberger, Jürgen Kogler, David M. Bevly, William Travis, Kevin Knoedler
Publikováno v:
Springer Tracts in Advanced Robotics ISBN: 9783540734284
This paper presents a summary of SciAutonics-Auburn Engineering’s efforts in the 2005 DARPA Grand Challenge. The areas discussed in detail include the team makeup and strategy, vehicle choice, software architecture, vehicle control, navigation, pat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f151e1ab18113550511b67e546ffb0e
https://doi.org/10.1007/978-3-540-73429-1_9
https://doi.org/10.1007/978-3-540-73429-1_9
Publikováno v:
SAE Technical Paper Series.
Autor:
W. Herzner, Robert Behringer, David M. Bevly, William Travis, Robert Daily, Wilfried Kubinger, V. Fehlberg
Publikováno v:
Proceedings. 2005 IEEE Intelligent Transportation Systems, 2005..
The DARPA Grand Challenge is a competition of autonomous ground vehicles in the Mojave desert, with a prize of } for the winner. This event was organized in 2004 and held annually at least until 2007, until a team wins the prize. The teams are coming
Autor:
David M. Bevly, R. Elsley, B. Gregory, B. Addison, Robert Daily, S. Sundareswaran, W. Guthmiller, Robert Behringer
Publikováno v:
IEEE Intelligent Vehicles Symposium, 2004.
The DARPA Grand Challenge (DGC) was an opportunity to test autonomous vehicles in a competitive situation. In addition to intelligent behaviour, the participating vehicles must also exhibit ruggedness and endurance in order to survive the fast ride o
Publikováno v:
International Journal of Vehicle Autonomous Systems. 5:230
This paper proposes a method to produce high update, accurate, observable estimates of vehicle sideslip, utilising a two antenna GPS system. Measurements are blended with a kinematic Kalman filter to get high update sideslip estimates, which are used