Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Robert Cuchet"'
Autor:
Kei Murayama, Robert Cuchet, Gilles Simon, Mitsuhiro Aizawa, Masahiro Sunohara, H. Feldis, Jean Charbonnier, Myriam Assous, Jean-Philippe Bally, Mitsutoshi Higashi, Ken Miyairi
Publikováno v:
International Symposium on Microelectronics. 2012:000984-000990
Silicon interposers with TSVs appear to open new possibilities thanks to high wiring density interconnections and improved electrical performances given by shorter interconnections from die to die and also from die to substrate. Silicon interposers a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73ac4947910caa691ab8377c513c6e99
https://doi.org/10.4071/isom-2012-wp63
https://doi.org/10.4071/isom-2012-wp63
Autor:
Nathalie Bernard-Henriques, Jean Charbonnier, Rachid Hida, H. Feldis, Mitsutoshi Higashi, Nicole Bouzaida, Ken Miyairi, Masahiro Sunohara, Robert Cuchet, Jean-Philippe Bally, Myriam Assous, Thierry Mourier, Gilles Simon
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
As standard organic substrate packages and wire bonding are reaching their limits in term of wiring density and integration capacity, silicon interposer approach combined with 3D integration technologies opens new possibilities in advanced packaging.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cd49fa8bd85631fce66c3affbbbfff8
https://doi.org/10.1109/estc.2012.6542156
https://doi.org/10.1109/estc.2012.6542156