Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Robert Bosch GmbH, Robert Bosch"'
Autor:
Simon, D., Wuest, H., Hinderberger, S., Koehler, T., Marusczyk, A., Sawatzki, S., Diop, L.V.B., Skokov, K., Maccari, F., Senyshyn, A., Ehrenberg, H., Gutfleisch, O.
Publikováno v:
Acta Materialia
Acta Materialia, Elsevier, 2019, 172, pp.131-138. ⟨10.1016/j.actamat.2019.04.006⟩
Acta Materialia, Elsevier, 2019, 172, pp.131-138. ⟨10.1016/j.actamat.2019.04.006⟩
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::dcddb28ae3aad13e15e709e22e720734
https://hal.archives-ouvertes.fr/hal-02380648
https://hal.archives-ouvertes.fr/hal-02380648
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2016, 66, pp.122-133. ⟨10.1016/j.microrel.2016.10.002⟩
Microelectronics Reliability, Elsevier, 2016, 66, pp.122-133. ⟨10.1016/j.microrel.2016.10.002⟩
IF=1.2; International audience; Today a point has been reached where lifetimes of power modules are limited by the standard packaging technologies, such as wire bonding. To surpass these limits, a new power module was designed using Cu clips as inter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::122eec3daa23c98c107555868c10f377
https://hal-uphf.archives-ouvertes.fr/hal-03448140
https://hal-uphf.archives-ouvertes.fr/hal-03448140
Publikováno v:
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, 2016, 16 (1), pp.80-97. ⟨10.1109/TDMR.2016.2516044⟩
IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, 2016, 16 (1), pp.80-97. ⟨10.1109/TDMR.2016.2516044⟩
IF=1.437; International audience; Electronic devices using semiconductors such as insulated-gate bipolar transistors, metal-oxide-semiconductor field-effect transistors, and diodes are extensively used in electrical traction applications such as loco
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dc0b79a85387a89fc4253612f0d183f6
https://hal-uphf.archives-ouvertes.fr/hal-03448115
https://hal-uphf.archives-ouvertes.fr/hal-03448115
Publikováno v:
CFM 2015-22ème Congrès Français de Mécanique
CFM 2015-22ème Congrès Français de Mécanique, Aug 2015, Lyon, France
Congrès Français de Mécanique CFM2015
Congrès Français de Mécanique CFM2015, Aug 2015, Lyon, France
CFM 2015-22ème Congrès Français de Mécanique, Aug 2015, Lyon, France
Congrès Français de Mécanique CFM2015
Congrès Français de Mécanique CFM2015, Aug 2015, Lyon, France
National audience; This paper studies the failure mechanisms and the reliability of the chip-metallization of a new power module using a copper clip soldered on the top side of the chip, instead of aluminum wire bonds. Both power cycling tests and th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::2a69085872a068e888baee5eddb7c3d1
https://hal.archives-ouvertes.fr/hal-03444889
https://hal.archives-ouvertes.fr/hal-03444889
Publikováno v:
Engineering Fracture Mechanics
Engineering Fracture Mechanics, Elsevier, 2015, 138, pp.127-145. ⟨10.1016/j.engfracmech.2015.02.020⟩
Engineering Fracture Mechanics, Elsevier, 2015, 138, pp.127-145. ⟨10.1016/j.engfracmech.2015.02.020⟩
IF=1.662; International audience; This paper studies the failure mechanisms occurring in the chip-metallization of a new power module using a copper clip soldered on the top side of the chip, instead of aluminum wire bonds. Both power cycling tests a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e392e84d3e106cb63cbb8e461f39e80d
https://hal-uphf.archives-ouvertes.fr/hal-03450932
https://hal-uphf.archives-ouvertes.fr/hal-03450932
Autor:
Durand, Camille, Klingler, Markus, Coutellier, Daniel, Naceur, Hakim, Grams, Arian, Wittler, Olaf
Publikováno v:
MATEC Web of Conferences
MATEC Web of Conferences, 2014, Paris, France. pp.04015
MATEC Web of Conferences, 2014, Paris, France. pp.04015
International audience; Thermo-mechanically induced failure is a major reliability issue in the microelectronic industry. On this account, a new type of Assembly Interconnected Technology used to connect MOSFETs in power modules has been developed. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::d26c5845d525bfb7d890b56a43ba00f2
https://hal.archives-ouvertes.fr/hal-01669938
https://hal.archives-ouvertes.fr/hal-01669938
Autor:
König R; Corporate Research, Robert Bosch GmbH, Robert-Bosch-Campus 1, 71272 Renningen, Germany.; Institute of Aerospace Systems, RWTH Aachen University, Wüllnerstraße 7, 52062 Aachen, Germany., Babetto L; Institute of Aerospace Systems, RWTH Aachen University, Wüllnerstraße 7, 52062 Aachen, Germany., Gerlach A; Corporate Research, Robert Bosch GmbH, Robert-Bosch-Campus 1, 71272 Renningen, Germany., Fels J; Institute for Hearing Technology and Acoustics, RWTH Aachen University, Kopernikusstraße 5, 52074 Aachen, Germany., Stumpf E; Institute of Aerospace Systems, RWTH Aachen University, Wüllnerstraße 7, 52062 Aachen, Germany.
Publikováno v:
The Journal of the Acoustical Society of America [J Acoust Soc Am] 2024 Sep 01; Vol. 156 (3), pp. 1929-1941.
Autor:
Wenzel M; Corporate Research, Robert Bosch GmbH, Robert-Bosch-Campus 1, 71272 Renningen, Germany.; Institute for Plastics Processing (IKV) in Industry and Craft at RWTH Aachen University, Seffenter Weg 201, 52074 Aachen, Germany., Raisch SR; Corporate Research, Robert Bosch GmbH, Robert-Bosch-Campus 1, 71272 Renningen, Germany., Schmitz M; Institute for Plastics Processing (IKV) in Industry and Craft at RWTH Aachen University, Seffenter Weg 201, 52074 Aachen, Germany., Hopmann C; Institute for Plastics Processing (IKV) in Industry and Craft at RWTH Aachen University, Seffenter Weg 201, 52074 Aachen, Germany.
Publikováno v:
Polymers [Polymers (Basel)] 2024 Aug 29; Vol. 16 (17). Date of Electronic Publication: 2024 Aug 29.
Autor:
Rajala P; Optoelectronics Research Centre (ORC), Physics Unit/Photonics, Faculty of Engineering and Natural Science, Tampere University, Korkeakoulunkatu 3, 33720 Tampere, Finland., Tatar-Mathes P; Optoelectronics Research Centre (ORC), Physics Unit/Photonics, Faculty of Engineering and Natural Science, Tampere University, Korkeakoulunkatu 3, 33720 Tampere, Finland., Phung HM; Optoelectronics Research Centre (ORC), Physics Unit/Photonics, Faculty of Engineering and Natural Science, Tampere University, Korkeakoulunkatu 3, 33720 Tampere, Finland.; Robert Bosch GmbH, Robert-Bosch-Campus 1, 71272 Renningen, Germany., Koskinen J; Optoelectronics Research Centre (ORC), Physics Unit/Photonics, Faculty of Engineering and Natural Science, Tampere University, Korkeakoulunkatu 3, 33720 Tampere, Finland., Ranta S; Optoelectronics Research Centre (ORC), Physics Unit/Photonics, Faculty of Engineering and Natural Science, Tampere University, Korkeakoulunkatu 3, 33720 Tampere, Finland., Guina M; Optoelectronics Research Centre (ORC), Physics Unit/Photonics, Faculty of Engineering and Natural Science, Tampere University, Korkeakoulunkatu 3, 33720 Tampere, Finland., Kahle H; Optoelectronics Research Centre (ORC), Physics Unit/Photonics, Faculty of Engineering and Natural Science, Tampere University, Korkeakoulunkatu 3, 33720 Tampere, Finland.; Department of Physics & Astronomy, The University of New Mexico, 210 Yale Boulevard NE, Albuquerque, New Mexico 87106 ,United States.
Publikováno v:
ACS photonics [ACS Photonics] 2024 Aug 25; Vol. 11 (9), pp. 3492-3501. Date of Electronic Publication: 2024 Aug 25 (Print Publication: 2024).