Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Robert Addison Boudreau"'
Publikováno v:
Journal of Microelectromechanical Systems. 5:66-72
We have studied the formation of etch hillock defects during anisotropic etching of (100) silicon in KOH. Defect density is correlated with low etchant concentration and high etch temperature. Cathodic etch experiments indicate that hillocks form und
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd2bcacbff9149221f110cf2d14d0e24
https://doi.org/10.1109/84.485218
https://doi.org/10.1109/84.485218
Publikováno v:
Journal of Micromechanics and Microengineering. 4:147-155
Etch hillocks are defects created during anisotropic etching of (100) silicon. From direct measurements of defect micrographs, we have determined the structure of etch hillocks to be pyramids bounded by (567) planes. The defects planes are different
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e47797688ccfdc129508d6096d48e70
https://doi.org/10.1088/0960-1317/4/3/008
https://doi.org/10.1088/0960-1317/4/3/008
Autor:
Thomas W. Fitzgerald, Craig Armiento, Marvin Tabasky, Paul O. Haugsjaa, Mark A. Rothman, A.J. Negri, Robert Addison Boudreau
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 15:1072-1080
Individually addressable, four-channel transmitter arrays operating at data rates of 1 Gb/s have been developed based on a hybrid optoelectronic integration approach called silicon waferboard. A key feature of silicon waferboard is the use of mechani
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67275ddd899676442296faf79be11701
https://doi.org/10.1109/33.206933
https://doi.org/10.1109/33.206933
Publikováno v:
Proceedings IEEE Micro Electro Mechanical Systems. 1995.
Various technologies have been developed to fabricate high aspect ratio microstructures on planar surfaces. In this work, we present a technology which exploits the highly ordered pore structure of anodic aluminum oxide. Using this technology, we hav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1fb8743c279ad35f852644f5dc56e29
https://doi.org/10.1109/memsys.1995.472536
https://doi.org/10.1109/memsys.1995.472536
Autor:
Marvin Tabasky, Mark A. Rothman, A.J. Negri, Robert Addison Boudreau, Paul O. Haugsjaa, R. Sargent, Thomas W. Fitzgerald, M. Urban, Craig Armiento
Publikováno v:
LEOS '92 Conference Proceedings.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b742c4dc81e916ad73e5edcea91700d5
https://doi.org/10.1109/leos.1992.693946
https://doi.org/10.1109/leos.1992.693946
Publikováno v:
Optical Science and Engineering ISBN: 9780824707064
Passive Micro-Optical Alignment Methods
Passive Micro-Optical Alignment Methods
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ade40658dac584292e3c3790a54dfbf
https://doi.org/10.1201/9781420027723.ch3
https://doi.org/10.1201/9781420027723.ch3
Autor:
Craig Armiento, Thomas W. Fitzgerald, Paul O. Haugsjaa, Marvin Tabasky, A.J. Negri, Robert Addison Boudreau, Mark A. Rothman
Publikováno v:
1992 Proceedings 42nd Electronic Components & Technology Conference.
Individually addressable, four-channel transmitter arrays operating at a wavelength of 1.3 mu m have been developed based on a hybrid optoelectronic integration approach called silicon waferboard. This approach uses micromachined silicon substrates a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a531e6043b74e1db9a7a91f72ccdbde1
https://doi.org/10.1109/ectc.1992.204192
https://doi.org/10.1109/ectc.1992.204192
Autor:
R. Sargent, M. Urban, Craig Armiento, R. Morrison, A. Bellows, Marvin Tabasky, Paul O. Haugsjaa, A.J. Negri, Robert Addison Boudreau, Victor Cataldo
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
Two new approaches are described for epi-down die bonding of diode lasers. The first approach, based on an acetic acid vapor flux, eliminates complications associated with the use of liquid flux in optoelectronic packaging. Based on this approach, In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8173a60a47147fa73642a2d13737a44e
https://doi.org/10.1109/ectc.1993.346801
https://doi.org/10.1109/ectc.1993.346801
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
Flip-chip solder joint technology has been widely used in the integrated circuit (IC) packaging and optoelectronics packaging. Several solder deposition techniques have been developed. In this paper, we will report on an electroplating technique to f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68a8abe82300c0f7b307e49116aac1ef
https://doi.org/10.1109/ectc.1996.550763
https://doi.org/10.1109/ectc.1996.550763
Publikováno v:
Proceedings IEEE Micro Electro Mechanical Systems An Investigation of Micro Structures, Sensors, Actuators, Machines and Robotic Systems.
We have studied the formation of etch hillock defects during anisotropic etching of [100] silicon in KOH. Defect density is correlated with low etchant concentration and high etch temperature. The activation energy for defect formation is 1.2 eV, con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60c468fc40f28441bbac58024e038ccd
https://doi.org/10.1109/memsys.1994.555628
https://doi.org/10.1109/memsys.1994.555628