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Publikováno v:
ICCAD
In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die variations in nanoscale manufacturing process. VP exploits recent breakth
Publikováno v:
2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers; Nov2009, p433-440, 8p