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pro vyhledávání: '"Rob Morton"'
Autor:
Rob Morton
Not only is this a companion book to the jazz punk album of the same name by the Taxpayers, this is a remembrance of a life filled with contradictions cowardice and bravery, falsehoods and candidness, glory and failure told from the perspective
Autor:
Matthew Higgins, Jay Witherspoon, John T. Novak, Greg Adams, Dave McEwen, Zeynep Erdal, Robert H. Forbes, Ron Hargreaves, Rob Morton
Publikováno v:
Proceedings of the Water Environment Federation. 2007:945-964
Autor:
Ron Hargreaves, John T. Novak, Greg Adams, Matthew J. Higgins, Robert H. Forbes, Zeynep Erdal, Jay Witherspoon, Rob Morton
Publikováno v:
Journal of environmental science and health. Part A, Toxic/hazardous substancesenvironmental engineering. 43(13)
The Water Environment Research Foundation (WERF) has sponsored three phases of a long-term project entitled "Identifying and Controlling Odors in the Municipal Wastewater Environment." The current (third) phase focuses on reduction of odors from dewa
Autor:
Rene Wientjes, Jerome Belledent, Laurent Le Cam, Johannes van Wingerden, Rob Morton, Yorick Trouiller, Yuri Aksenov, Michael Benndorf
Publikováno v:
SPIE Proceedings.
The continued downscaling of the feature sizes and pitches for each new process generation increases the challenges for obtaining sufficient process control. As the dimensions approach the limits of the lithographic capabilities, new solutions for im
Autor:
Jerome Belledent, Scott Warrick, Juan-Manuel Gomez, Alex Barr, Emmanuel Sicurani, Rob Morton, Jan-Willem Gemmink, Kevin Lucas, David Cruau, Valerie Plantier, Andrea Mauri, C. Monget, Will Conley, Jean-Damien Chapon
Publikováno v:
SPIE Proceedings.
Semiconductor manufacturers are in the midst of the next technology node C045 (65nm half-pitch) development. The difference this time is that the heavy lifting is being done while swimming. Generally, for the C065 node (hp90), critical layers will be
Alignment robustness for 90 nm and 65 nm node through copper alignment mark integration optimization
Autor:
Richard Johannes Franciscus Van Haren, Rob Morton, Henry Megens, Paul Christiaan Hinnen, Kevin E. Cooper, Clyde Browning, Jerome Depre, Ramon Navarro, Scott Warrick, Pierre-Olivier Sassoulas, Doug Reber
Publikováno v:
Optical Microlithography XVIII.
In this paper, methods for stacking ASML scribe lane alignment marks (SPM) and improving the mark performance at initial copper metal levels are discussed. The new mark designs and the theoretical reasons for mark design and/or integration change are
Publikováno v:
SPIE Proceedings.
Assessment for introduction of immersion lithography into volume manufacturing has recently started, where one of the key focus areas includes defectivity. Particularly, the possible presence of bubbles in the immersion liquid could act as a defect s