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Publikováno v:
Soldering & Surface Mount Technology. 23:85-90
PurposeThe purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry pract
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f91ae791936ca0696757885d2362d4d1
https://doi.org/10.1108/09540911111120159
https://doi.org/10.1108/09540911111120159
Publikováno v:
Soldering & Surface Mount Technology. Apr2011, Vol. 23 Issue 2, p85-90. 6p.