Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Rjmm Rob Snijkers"'
Publikováno v:
Journal of Applied Physics, 89(4), 2033-2039. American Institute of Physics
Low luminous efficacy is one of the major drawbacks of plasma display panels (PDPs), where the main limiting factor is the efficiency of the microdischarges in generating UV radiation. In this work we use a two-dimensional self-consistent fluid model
Publikováno v:
Journal of Applied Physics, 88(19), 5538-5542. American Institute of Physics
In fluid models of the gas discharges in plasma display panels, the trapping of resonance radiation is usually accounted for by a trapping factor. In this work, we present a Monte Carlo model for resonance photons, which gives a much more accurate de
Autor:
MB Marc Hoppenbrouwers, van Mjm Marcel Sambeek, Rjmm Rob Snijkers, Gmw Gerrit Kroesen, de Fj Frits Hoog
Publikováno v:
Journal of Applied Physics, 79(12), 8982-8992. American Institute of Physics
The ion energy distributions (IEDs) at the electrodes in a capacitively coupled 13.56 MHz plasma in CF4 have been measured mass resolved with a Balzers quadrupole in combination with a home-built energy analyzer. Mass-resolved determination offers th
Autor:
de Fj Frits Hoog, Holger Kersten, Rjmm Rob Snijkers, J Schulze, H. Deutsch, Gmw Gerrit Kroesen
Publikováno v:
Applied Physics Letters, 64(12), 1496-1498. American Institute of Physics
The thermal energy flux which a rf plasma delivers to a silicon surface has been studied by a calorimetric method. The energy flux appears to be proportional to the product of the average ion energy and the ion flux, which was calculated from the Boh
Publikováno v:
Applied Physics Letters, 63(3), 308-310. American Institute of Physics
The mass‐resolved ion energy distribution (IED) at the grounded electrode has been determined in a 13.56‐MHz parallel‐plate plasma in argon. The IED is determined of Ar+, Ar2+, Ar2+, ArH+, H3O+, and H3+ for several plasma conditions. At pressur
Publikováno v:
Advanced Technologies Based on Wave and Beam Generated Plasmas ISBN: 9789048151912
In present day production technology, the fabrication of integrated circuits (IC’s) is unthinkable without plasmas being used for etching and deposition purposes. For deposition, the plasmas produce reactive species which are deposited on the subst
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf2e81f53841d182225cb4b63e4d0edf
https://doi.org/10.1007/978-94-017-0633-9_8
https://doi.org/10.1007/978-94-017-0633-9_8