Zobrazeno 1 - 10
of 42
pro vyhledávání: '"Rita MOHD SAID"'
Autor:
Mohd Izrul Izwan RAMLI, Rita MOHD SAID, Flora SOMIDIN, Siti Farahnabilah MUHD AMLI, Siti Nor Atirah MUSTAPHA
Publikováno v:
European Journal of Materials Science and Engineering, Vol 8, Iss 2, Pp 69-73 (2023)
In this study, the effect of growth microstructure on diffusion and intermetallic compound of Sn-58Bi/SAC305 solder joint with different of SAC305 size and reflow temperature had been studied. For effect of different size, it used 180°C reflow tempe
Externí odkaz:
https://doaj.org/article/717cf962b6d3437b83827c282c088d54
Autor:
Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Mohd Mustafa Al Bakri Abdullah, Dewi Suriyani Che Halin, Norainiza Saud, Marcin Nabiałek
Publikováno v:
Metals, Vol 11, Iss 3, p 380 (2021)
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu sold
Externí odkaz:
https://doaj.org/article/8b3a716472bf4f6ab1904847e74eaad1
Publikováno v:
Recent Progress in Lead-Free Solder Technology ISBN: 9783030934408
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a4d4289c0a5d9bc55a6db77896f70b5
https://doi.org/10.1007/978-3-030-93441-5_5
https://doi.org/10.1007/978-3-030-93441-5_5
Autor:
Norainiza Saud, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Flora Somidin, Nur Syahirah Mohamad Zaimi, Mohd Izrul Izwan Ramli
Publikováno v:
Recent Progress in Lead-Free Solder Technology ISBN: 9783030934408
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d21fb01feecb3a8d95d6c2d83a2b73cf
https://doi.org/10.1007/978-3-030-93441-5_1
https://doi.org/10.1007/978-3-030-93441-5_1
Autor:
Muhammad Alif Haikal Abdul Ghani, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Norainiza Saud
Publikováno v:
PROCEEDINGS OF 8TH INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS ENGINEERING & TECHNOLOGY (ICAMET 2020).
In this research, the microstructure evolution of Sn-Cu based solder paste on the electroless nickel immersion gold substrate was investigated. The aims are to study the microstructure formation of as-reflowed Sn-10 wt.% Cu paste on the substrate. Be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c0d4d785823fca9cefe638460085a04
https://doi.org/10.1063/5.0051918
https://doi.org/10.1063/5.0051918
Publikováno v:
Solid State Phenomena. 280:206-211
The evolution in microstructure of Sn-Cu based solder paste with different copper (Cu) content subjected to multiple reflow cycles was investigated. In this study, the Sn-0.7Cu (SC) solder paste was used as based material. The Cu particles were added
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6603af0f18e3b658c380de3f9ba4ac2a
https://doi.org/10.4028/www.scientific.net/ssp.280.206
https://doi.org/10.4028/www.scientific.net/ssp.280.206
Publikováno v:
Solid State Phenomena. 280:163-168
This paper studied the thermal stability of Sn-0.7Cu (SC) and Sn-0.7Cu-0.05Ni (SCN) solder paste after soldering and during subsequent aging. Isothermal aging was conducted for 24, 240 and 480 hours at a temperature of 75, 125, and 150 °C respective
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5704811286794cd5480d0e75d6fbe404
https://doi.org/10.4028/www.scientific.net/ssp.280.163
https://doi.org/10.4028/www.scientific.net/ssp.280.163
Publikováno v:
Solid State Phenomena. 280:157-162
In this study, the effect of Zinc (Zn) addition on microstructure, interfacial IMC and wettability properties of Sn-0.7Cu lead free solder alloy was investigated. The addition of 0.5, 1.0 and 1.5 wt.% Zn into Sn-0.7Cu was developed by using conventio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b44252b53d9c9b8df8f66c3647109ad6
https://doi.org/10.4028/www.scientific.net/ssp.280.157
https://doi.org/10.4028/www.scientific.net/ssp.280.157
Publikováno v:
Solid State Phenomena. 280:200-205
This research examines the influences of minor addition of Zn on the thermal and mechanical properties in Sn-0.7Cu solder alloy. The addition of 0.5, 1.0 and 1.5 wt.% of Zn were added into Sn-0.7Cu by using conventional casting method. It show that m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc3b41dfc069834d03e3655d5ef2bdff
https://doi.org/10.4028/www.scientific.net/ssp.280.200
https://doi.org/10.4028/www.scientific.net/ssp.280.200
Autor:
Norainiza Saud, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Mohd Mustafa Abdullah Al Bakri, N.S. Mohamad Zaimi
Publikováno v:
Solid State Phenomena. 280:169-174
A non metallic reinforcement has attracted most of the worldwide researchers to enhance solder performance. Silicon carbide (SiC) particle is a semiconductor which had been used as a non metallic reinforcement in this research study.The fabrication o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85c633621c733bc87f62b89bacc25d6f
https://doi.org/10.4028/www.scientific.net/ssp.280.169
https://doi.org/10.4028/www.scientific.net/ssp.280.169