Zobrazeno 1 - 10
of 76
pro vyhledávání: '"Risako Kibushi"'
Autor:
Kazuhisa YUKI, Risako KIBUSHI, Rikako TSUJI, Kio TAKAI, Noriyuki UNNO, Tetsuro OGUSHI, Masaaki MURAKAMI, Tomiyuki NUMATA, Hikaru NOMURA, Takuya IDE
Publikováno v:
Journal of Thermal Science and Technology, Vol 15, Iss 1, Pp JTST0012-JTST0012 (2020)
In this study, we quantitatively discuss several kinds of thermal resistances that rise up to the surface in thermal management of automotive SiC-based on-board inverters with extremely high heat flux of 500 W/cm2. It is proven that a stacking struct
Externí odkaz:
https://doaj.org/article/6c146b4b0f404b1ea6e5b539e2295a29
Autor:
Kazuhisa Yuki, Risako Kibushi, Ryohei Kubota, Noriyuki Unno, Shigeru Tanaka, Kazuyuki Hokamoto
Publikováno v:
Energies, Vol 15, Iss 3, p 1042 (2022)
To discuss a suitable porous structure for helium gas cooling under high heat flux conditions of a nuclear fusion divertor, we first evaluate effective thermal conductivity of sintered copper-particles in a simple cubic lattice by direct numerical he
Externí odkaz:
https://doaj.org/article/e623e7580aac41e68403f37b0f5bfa10
Publikováno v:
Journal of Electronic Packaging. 145
Boiling heat transfer (BHT) is a promising technique for cooling the high heat flux emitted from next-generation electronic devices. However, critical heat flux (CHF) is a significant problem in BHT because it restricts the maximum performance of coo
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Boiling heat transfer (BHT) is a promising technique to remove a high heat flux emitted from next-generation electronic devices. However, critical heat flux (CHF) is a big problem in BHT because it restricts the maximum performance of the cooling dev
Publikováno v:
International Journal of Heat and Mass Transfer. 195:123123
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
There is a strong demand for compact cooling devices, which can remove a high heat flux. Boiling heat transfer attracts a lot of attention because of its higher heat transfer coefficient than conventional techniques using a single-phase flow. To desi
Publikováno v:
Fusion Engineering and Design. 136:518-521
Heat transfer performance of divertor cooling device EVAPORON-4, which was developed in order to remove a high heat flux of 10 MW/m2 under low pumping power conditions, is evaluated. Uni-directional porous media used in EVAPORON-4 make it possible to
Autor:
Tetsuro Ogushi, Masaaki Murakami, Takuya Ide, Tomiyuki Numata, Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Hikaru Nomura
Publikováno v:
International Journal of Heat and Mass Transfer. 179:121663
In this study, to improve the heat transfer performance of two-phase immersion cooling with saturated pool boiling using the “breathing phenomenon”, we evaluate the heat transfer performance of boiling surfaces composed of a lotus copper joined t