Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Rijnbeek, R.A."'
Autor:
Lange, T.J. de, Man, H. de, Bruijn, D. de, Hazelebach, R.L.M., Rijnbeek, R.A., Baeten, M.J.J., Silvestri, F., Human, J.D., Witvoet, G., Crowcombe, W.E.
Publikováno v:
TNO Optical SATCOM Day, Delft, 7 November 2019
LEOCAT is an optical head for intersatellite communication currently under development by TNO (ESA ARTES contract). The objective of LEOCAT is to develop a low recurring cost low SWAP (Size Weight and Power) optical head for the optical satellite com
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::c28b2e4c786ae3b540de17db6a2b210c
http://resolver.tudelft.nl/uuid:7e23e1c2-e728-4057-98dc-cc161f31ff44
http://resolver.tudelft.nl/uuid:7e23e1c2-e728-4057-98dc-cc161f31ff44
Autor:
Kuiper, S., Fritz, E.C., Crowcombe, W.E., Liebig, T., Kramer, G.F.I., Witvoet, G., Duivenvoorde, T., Overtoom, A.J., Rijnbeek, R.A., Zwet, E.J. van, Dijsseldonk, A. van, Boef, A. den, Beems, M., Levasier, L.
Publikováno v:
Sanchez, M.I.Ukraintsev, V.A., 30th Conference on Metrology, Inspection, and Process Control for Microlithography, 22-25 February 2016, 9778
Nowadays most overlay metrology tools assess the overlay performance based on marker features which are deposited next to the functional device features within each layer of the semiconductor device. However, correct overlay of the relatively coarse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::11a6679a4969054dbfbc01c4cb269935
http://resolver.tudelft.nl/uuid:37309d0e-df8b-4a85-bc03-d598d1d498a5
http://resolver.tudelft.nl/uuid:37309d0e-df8b-4a85-bc03-d598d1d498a5
Autor:
Sadeghian Marnani, H., Dekker, A., Herfst, R.W., Winters, J., Eigenraam, A.B.C., Rijnbeek, R.A., Nulkes, N.
Publikováno v:
Cain, J.P.Sanchez, M.I., SPIE Advanced Lithography conference on Metrology, Inspection, and Process Control for Microlithography XXIX, 22-26 February 2015, San Jose, California, USA, 9424
With the device dimensions moving towards the 1X node and below, the semiconductor industry is rapidly approaching the point where existing metrology, inspection and review tools face huge challenges in terms of resolution, the ability to resolve 3D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::a5f383590215494f7ebbc0258e76e115
http://resolver.tudelft.nl/uuid:33268b1f-f7ec-406f-8777-abcd068f703a
http://resolver.tudelft.nl/uuid:33268b1f-f7ec-406f-8777-abcd068f703a