Minimizing the Bondline Thermal Resistance in Thermal Interface Materials Without Affecting Reliability

Autor: Emerson, J. A., Rightley, M. J., Galloway, J.A., Rae, D. F., Huber, Dale. L., Cotts, Eric J.

Publikováno v: International Worshop on THERMal INvestigations of ICs and Systems
THERMINIC 2005
THERMINIC 2005, Sep 2005, Belgirate, Lago Maggiore, Italy. pp.106-111

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; As electronic assemblies become more compact, with increased processing bandwidth and higher energy fluxes, thermal management is li

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::721be1d4758aba5a09388549521aceb8
https://hal.archives-ouvertes.fr/hal-00189460