Zobrazeno 1 - 10
of 56
pro vyhledávání: '"Riet Labie"'
Autor:
Bart Vandevelde, Riet Labie, Ralph Lauwaert, Rainer Dudek, Przemyslaw Gromala, Michael Eichorst
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Autor:
Tim Stakenborg, Joren Raymenants, Ahmed Taher, Elisabeth Marchal, Bert Verbruggen, Sophie Roth, Ben Jones, Abdul Yurt, Wout Duthoo, Klaas Bombeke, Maarten Fauvart, Julien Verplanken, Rodrigo S. Wiederkehr, Aurelie Humbert, Chi Dang, Evi Vlassaks, Alejandra L. Jáuregui Uribe, Zhenxiang Luo, Chengxun Liu, Kirill Zinoviev, Riet Labie, Aduen Darriba Frederiks, Jelle Saldien, Kris Covens, Pieter Berden, Bert Schreurs, Joost Van Duppen, Rabea Hanifa, Megane Beuscart, Van Pham, Erik Emmen, Annelien Dewagtere, Ziduo Lin, Marco Peca, Youssef El Jerrari, Chinmay Nawghane, Chad Arnett, Andy Lambrechts, Paru Deshpande, Katrien Lagrou, Paul De Munter, Emmanuel André, Nik Van den Wijngaert, Peter Peumans
Publikováno v:
BIOSENSORS & BIOELECTRONICS
The SARS-CoV-2 pandemic has highlighted the need for improved technologies to help control the spread of contagious pathogens. While rapid point-of-need testing plays a key role in strategies to rapidly identify and isolate infectious patients, curre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8c06bc8c3cda6c91b6efc75157e2fc7f
https://biblio.vub.ac.be/vubir/molecular-detection-of-sarscov2-in-exhaled-breath-at-the-pointofneed(c79954a9-37f0-4fbd-8267-d5a402d3a05c).html
https://biblio.vub.ac.be/vubir/molecular-detection-of-sarscov2-in-exhaled-breath-at-the-pointofneed(c79954a9-37f0-4fbd-8267-d5a402d3a05c).html
ispartof: 2022 23RD INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) ispartof: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::74548b2275ff4a9ea476ba839082d802
https://lirias.kuleuven.be/handle/20.500.12942/704649
https://lirias.kuleuven.be/handle/20.500.12942/704649
Autor:
Tim Stakenborg, Joren Raymenants, Ahmed Taher, Elisabeth Marchal, Bert Verbruggen, Sophie Roth, Ben Jones, Abdul Yurt, Wout Duthoo, Klaas Bombeke, Maarten Fauvart, Julien Verplanken, Rodrigo Wiederkehr, Aurelie Humbert, Chi Dang, Evi Vlassaks, Alejandra Jauregui Uribe, Zhenxiang Luo, Chengxun Liu, Kirill Zinoviev, Riet Labie, Aduén Darriba Frederiks, Jelle Saldien, Kris Covens, Pieter Berden, Bert Schreurs, Joost Van Duppen, Rabea Hanifa, Megane Beuscart, Van Pham, Erik Emmen, Annelien Dewagtere, Ziduo Lin, Marco Peca, Youssef El Jerrari, Chinmay Nawghane, Chad Arnett, Andy Lambrechts, Paru Deshpande, Katrien Lagrou, Paul De Munter, Emmanuel André, Nik Van den Wijngaert, Peter Peumans
The SARS-CoV-2 pandemic has highlighted the need for improved technologies to help control the spread of contagious pathogens. While rapid point-of-need testing plays a key role in strategies to rapidly identify and isolate infectious patients, a cor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27ccd462d3f7d4516759c5a6f1ca330a
https://doi.org/10.21203/rs.3.rs-1104361/v1
https://doi.org/10.21203/rs.3.rs-1104361/v1
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
SnBi based solder alloys become an interesting alternative for standard SnAgCu as they can be used to solder components at much lower temperature. The typically 50°C lower solder reflow temperature is less damaging for PCB and components, and also p
Publikováno v:
2021 Smart Systems Integration (SSI)
This paper presents an overview of challenges in system integration for 2.5D/3D assemblies, including copackaged optics and electronics, MEMS and microfluidics. It addresses the gap between early-stage prototypes and volume manufacturing that need tr
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This work concerns the impact of mounting the PCB onto the housing with respect to the reliability of the solder joints of components assembled to this board. Due to the thermal expansion mismatch between the housing and PCB, additional stress is app
Publikováno v:
ECS Transactions. 86:137-146
Cost reduction is one of the major driving forces in the technology development of silicon solar cells. This explains the current interest in the implementation of a copper-based metallization, replacing more expensive Ag contacts [1-3]. In order to
Autor:
Bart Allaert, Riet Labie, Johan De Baets, Lieven Degrendele, Filip Vanhee, Franco Zanon, Bart Vandevelde, Ralph Lauwaert, Geert Willems, Davy Pissoort
Publikováno v:
Microelectronics Reliability. 74:131-135
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Autor:
Eddy Blansaer, Riet Labie, Ralph Lauwaert, Daniel Werkhoven, Davy Pissoort, Daniel Vanderstraeten, Jonas Lannoo, Bart Vandevelde
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In this work, the solder joint reliability of QFN components is experimentally tested in thermal cycling and four-point bending cycling conditions, and this for three different solder materials: standard SAC305, low Ag SAC alloy and a new low melting