Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Ridvan A. Sahan"'
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Current technological developmental efforts for high performing liquid assisted air-cooling solution (LAAC) is presented in this research. The roadmap needs of high-power packages such as client, datacenter and graphics product segments are addressed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ccc457d36d89460fe4bd10d3ed8fb8c7
https://doi.org/10.1115/ipack2021-73954
https://doi.org/10.1115/ipack2021-73954
Autor:
Prabhakar Subrahmanyam, Muhammad Ahmad, Ying-Feng Pang, Rahima K. Mohammed, Ridvan A. Sahan, Amy Xia, Tong W. Chao
Publikováno v:
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
With the ever increasing trend of cramming more transistors on the silicon and the consequential increase in the thermal design power, combined with stacked die and multiple die configurations inside the package footprint, optimized coolant chambers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::722cdf3dd45b179e7f77cc70a6d2794d
https://doi.org/10.1109/itherm.2017.7992538
https://doi.org/10.1109/itherm.2017.7992538
Publikováno v:
2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
Air-cooled based thermal margining tool is simple, less costly and reliable cooling solution compared to liquid-cooled thermal tool. Air-cooled thermal tool is used by many Intel® groups for different purposes such as CPU, chipset or ASIC debug and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1977fbd8ca5951a07a94e0133c7a3814
https://doi.org/10.1109/stherm.2012.6188873
https://doi.org/10.1109/stherm.2012.6188873
Publikováno v:
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
Thermal tools provide temperature margining capability by varying the case temperature at silicon thermal design power (TDP). They are used for process, voltage, temperature and frequency (PVTF) testing by Intel's post-silicon validation customers ac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3eddeefd0a3e024f7908e76351616ad
https://doi.org/10.1109/stherm.2011.5767210
https://doi.org/10.1109/stherm.2011.5767210
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2.
Increasing thermal design power (TDP) trends with shrinking form factor requirements creates the need for advanced cooling technology development. This investigation proposes multiple innovative water cooler technologies to achieve higher thermal per
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad3551286bf087e13bc7d97b92b2acd1
https://doi.org/10.1115/ipack2011-52225
https://doi.org/10.1115/ipack2011-52225
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Rapid advances in the semiconductor process technology have led to miniaturization of transistor features and advent of multi-core architecture. At the silicon-level while bus speeds, features and functionalities are increasing, at the system-level,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7ea2e65587b7aefafcc256ee83bd10a
https://doi.org/10.1109/itherm.2010.5501262
https://doi.org/10.1109/itherm.2010.5501262
Publikováno v:
ASME 2009 InterPACK Conference, Volume 2.
Unprecedented growth in the semiconductor industry has been enabled by decreasing transistor feature size. As silicon technology continues to scale per Moore’s law, multi-core and many-core are the new trends of the semiconductor industry. While bu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a45eb676a6d0a706fc63a08e0158e88
https://doi.org/10.1115/interpack2009-89412
https://doi.org/10.1115/interpack2009-89412
Publikováno v:
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
Validation platforms are used to validate processors/chipsets to ensure Intel providing world-class quality and reliable products. In this paper, experimental methodologies of thermal, mechanical, acoustics, shock and vibration and ergonomic tests ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0594c346f1429386973086ab83623da3
https://doi.org/10.1109/stherm.2009.4810759
https://doi.org/10.1109/stherm.2009.4810759
Autor:
Ridvan A. Sahan, Farzam Roknaldin
Publikováno v:
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2.
Processor powers of 30–60W are becoming very common in electronic industry. With constraints such as available heat sink space and the cost of the thermal solution, heat sink optimization has become one of the major concerns in the final design pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f22dd6b8ab803191555c19c274fe446f
https://doi.org/10.1115/ipack2003-35294
https://doi.org/10.1115/ipack2003-35294
Publikováno v:
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2.
An Optical Network Unit (ONU) used in Fiber-to-the-Curb (FTTC) system is one of the last mile equipment in telecommunications industry. The ONU usually operates in an outdoor environment like many other telecommunications cabinets. The ONU, in this s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc15a8c27c269f7653941dabf2694aea
https://doi.org/10.1115/ipack2003-35348
https://doi.org/10.1115/ipack2003-35348