Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Ricky Agrawal"'
Autor:
Anu Srivastava, Khanh Tran, Kiyoko Ikeuchi, Ricky Agrawal, Vivek Sridharan, Viren Khandekar, Amit S. Kelkar
Publikováno v:
International Symposium on Microelectronics. 2016:000410-000414
The ever increasing demand for high levels of integration and miniaturization has created new transistor nodes, shrunk redistribution line width/space, and driven a reduction in solder bump pitch. This has created the need for Fan-out packaging. This
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2bc585f4c0417e6ab1d268b33f4836d
https://doi.org/10.4071/isom-2016-tha23
https://doi.org/10.4071/isom-2016-tha23
