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pro vyhledávání: '"Rick Brewer"'
Autor:
Rick Brewer, Fred Rebarber, James Hom, Hae-won Choi, Mark Mcmaster, Sudhakar Gopalakrishnan, Girish Upadhya, Eric Lin, Madhav Datta, Doug Werner
Publikováno v:
ECS Transactions. 6:13-31
Heat removal from advanced microelectronic devices is becoming a major packaging challenge. Thermal management solutions such as microchannel liquid cooling are now becoming commercially available. The use of a liquid cooling system is attractive bec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ddfa11b6a72cfe30185bb57652507e5d
https://doi.org/10.1149/1.2794452
https://doi.org/10.1149/1.2794452
