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pro vyhledávání: '"Richen Chen"'
Autor:
Richen Chen, Seow Fui Shi, Jun Dimaano, Choon Ghee Ang, Eric Bool, Gu Bin, Nathapong Suthiwongsunthorn
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
The package warpage induced by residual stresses during molding process is one of the major thermo-mechanical reliability concerns in IC packaging. This paper proposes a method to find solution to unit warpage control with universal die thickness tha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04a5a0e39da0fa62a6ab444dadd5e6dc
https://doi.org/10.1109/eptc.2014.7028392
https://doi.org/10.1109/eptc.2014.7028392
