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Autor:
William J. Borland, Richard Ray Traylor, John J. Felten, Marc Doyle, Mark S. Lux, Diptarka Majumdar, Lynne E. Dellis, Alton Bruce Jones, Saul Ferguson
Publikováno v:
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2.
Combining thick-film and printed wiring board processes allows thick-film ceramic resistors and capacitors to be embedded in printed wiring boards (PWB). The resistor materials are based on lanthanum boride and cover the range of 10 ohm/square to 10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec27ad97ec2f3c708ae1005bb28beb22
https://doi.org/10.1115/ipack2003-35090
https://doi.org/10.1115/ipack2003-35090
