Zobrazeno 1 - 10
of 66
pro vyhledávání: '"Richard Perdriau"'
Autor:
Qazi Mashaal Khan, Lokesh Devaraj, Richard Perdriau, Alastair R. Ruddle, Tim Claeys, Mohamed Ramdani, Mohsen Koohestani
Publikováno v:
IEEE Access, Vol 10, Pp 83898-83915 (2022)
The reliable operation of an integrated circuit can be affected by environmental changes, such as of multiple frequency electromagnetic (EM) disturbances and temperature variations. This paper compares the performance of two oscillator circuits, name
Externí odkaz:
https://doaj.org/article/f978c24960974cf1825ee8cb642e7b47
Autor:
Oskari Leppäaho, Frédéric Lafon, Priscila Fernández-López, Marine Stojanovic, Tim Claeys, Richard Perdriau, Mohamed Ramdani
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, 2023, 65 (2), pp.395-405. ⟨10.1109/TEMC.2023.3244061⟩
IEEE Transactions on Electromagnetic Compatibility, 2023, 65 (2), pp.395-405. ⟨10.1109/TEMC.2023.3244061⟩
International audience; Transfer impedance is a main characteristic to describe the shielding performance of shielded cables at least up to 1 GHz. Traditionally, methods like line-injection and triaxial cell have been used to characterize it at ambie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::14c95962a142faf7a0f1afc016ff5992
https://doi.org/10.1109/temc.2023.3244061
https://doi.org/10.1109/temc.2023.3244061
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, 2022, pp.1-11. ⟨10.1109/TEMC.2022.3225540⟩
IEEE Transactions on Electromagnetic Compatibility, 2022, pp.1-11. ⟨10.1109/TEMC.2022.3225540⟩
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a769daaeac82fde602adc9b49e704546
https://doi.org/10.1109/temc.2022.3225540
https://doi.org/10.1109/temc.2022.3225540
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, 2023, pp.1-9. ⟨10.1109/TEMC.2023.3272020⟩
IEEE Transactions on Electromagnetic Compatibility, 2023, pp.1-9. ⟨10.1109/TEMC.2023.3272020⟩
International audience; In this article, an inexpensive passive approach is proposed, both making the immunity of integrated circuits (ICs) less dependent on their orientation and controlling the immunity of specific pins. This technique is based on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0d5e3276b6c771297c8ad6b9928edf7a
https://hal.science/hal-04123018
https://hal.science/hal-04123018
Publikováno v:
IEEE Letters on Electromagnetic Compatibility Practice and Applications
IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2022, 4 (2), pp.25-30. ⟨10.1109/LEMCPA.2022.3163963⟩
IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2022, 4 (2), pp.25-30. ⟨10.1109/LEMCPA.2022.3163963⟩
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0b1c2df61b311d3e1015c254aa916f06
https://doi.org/10.1109/lemcpa.2022.3163963
https://doi.org/10.1109/lemcpa.2022.3163963
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, 2023, pp.1-14. ⟨10.1109/TEMC.2023.3253385⟩
IEEE Transactions on Electromagnetic Compatibility, 2023, ⟨10.1109/TEMC.2023.3253385⟩
IEEE Transactions on Electromagnetic Compatibility, 2023, pp.1-14. ⟨10.1109/TEMC.2023.3253385⟩
IEEE Transactions on Electromagnetic Compatibility, 2023, ⟨10.1109/TEMC.2023.3253385⟩
International audience; Environmental factors, such as aging and thermal stress, can seriously impact the electromagnetic compatibility behavior of an integrated circuit (IC). The standardized IC emission model for conducted emission (ICEM-CE) and IC
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::07f58e62f941579bf7d079b4c14a3640
https://hal.science/hal-04123013
https://hal.science/hal-04123013
Publikováno v:
IEEE Letters on Electromagnetic Compatibility Practice and Applications
IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2023, 5 (1), pp.27-32. ⟨10.1109/LEMCPA.2023.3240621⟩
IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2023, ⟨10.1109/LEMCPA.2023.3240621⟩
IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2023, 5 (1), pp.27-32. ⟨10.1109/LEMCPA.2023.3240621⟩
IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2023, ⟨10.1109/LEMCPA.2023.3240621⟩
International audience; This paper compares the electromagnetic compatibility (EMC) performance of three different voltage regulator ICs (i.e. UA78L05, L78L05 and MC78L05) developed by three different manufacturers, with similar functionality and pin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c360e9af51a544598649e1853ca4e540
https://univ-angers.hal.science/hal-03993665v2/document
https://univ-angers.hal.science/hal-03993665v2/document
Publikováno v:
22nd IEEE International Conference on Software Quality, Reliability and Security (QRS)
22nd IEEE International Conference on Software Quality, Reliability and Security (QRS), Dec 2022, Guangzhou, China. ⟨10.1109/QRS-C57518.2022.00020⟩
22nd IEEE International Conference on Software Quality, Reliability and Security (QRS), Dec 2022, Guangzhou, China. ⟨10.1109/QRS-C57518.2022.00020⟩
Nowadays, System-on-Chip (SoC) components are found everywhere in all kinds of smart devices. Each System-on-Chip contains many different blocks that provide specific functionalities, such as WiFi or Bluetooth connectivity. Whereas integrating each s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::086caff171bd096411e6d171c64d8206
https://doi.org/10.36227/techrxiv.21135706
https://doi.org/10.36227/techrxiv.21135706
Autor:
Lokesh Devaraj, Qazi Mashaal Khan, Alastair R. Ruddle, Alistair P. Duffy, Richard Perdriau, Mohsen Koohestani
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, 2022, 64 (6), pp.2067-2079. ⟨10.1109/TEMC.2022.3211458⟩
IEEE Transactions on Electromagnetic Compatibility, 2022, 64 (6), pp.2067-2079. ⟨10.1109/TEMC.2022.3211458⟩
The research leading to these results has received funding from the European Union’s Horizon 2020 research and innovation programme under the Marie Skłodowska-Curie grant agreement No 812790 (MSCA-ETN PETER). The file attached to this record is th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7b5fb45a31d0d96dd0ed13cc59a9ca52
https://doi.org/10.1109/TEMC.2022.3211458
https://doi.org/10.1109/TEMC.2022.3211458
Autor:
Oskari Leppaaho, Frederic Lafon, Bruno Ferreri, Priscila Fernandez-Lopez, Marine Stojanovic, Richard Perdriau, Mohammed Ramdani
Publikováno v:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Sep 2022, Gothenburg, Sweden. pp.811-815, ⟨10.1109/emceurope51680.2022.9901089⟩
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Sep 2022, Gothenburg, Sweden. pp.811-815, ⟨10.1109/emceurope51680.2022.9901089⟩
International audience; Transfer impedance of shielded cables is a main characteristic to describe cable shielding performance at least up to 1 GHz. Traditionally, a cable shield consists of a braid, a foil, or a combination of them. Braids have attr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a9bfb520d4db31a25766d821b580c6ad
https://hal.science/hal-03833467
https://hal.science/hal-03833467