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Autor:
Javier Ayala, W. Steer, S. Conti, K. Tabakman, Richard O. Henry, Chienfan Yu, E. Meyette, R. Arndt, J. Levy, R. Burda, R. Keyser, R. Van Roijen, Jeffery B. Maxson
Publikováno v:
2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference.
In semiconductor manufacturing, we expect the cause of defects to be process or tool related. However, at the 90 nm technology node and beyond we find that defects can be caused by issues related to the wafers' environment, such as processing of othe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::77082661725cce2b4fd6763d895516f8
https://doi.org/10.1109/asmc.2011.5898199
https://doi.org/10.1109/asmc.2011.5898199
