Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Richard DeWitt Crisp"'
Autor:
Yiu-Fai Chan, Bryce D. Horine, Kevin S. Donnelly, M. Allen, Benedict Lau, J. Liu, John T. Ho, M. Muthal, Leung Yu, Michael W. Leddige, J. Wei, Richard DeWitt Crisp, R. Tarver, J. Salmon, F. Tsern, Haw-Jyh Liaw, Trang Nguyen, Kuojim Huang, Roxanne Vu, Yuwen Hsia, Cliff C. Lee, J. Hudson, Alfredo Moncayo, David Nguyen
Publikováno v:
IEEE Journal of Solid-State Circuits. 33:1617-1626
A 2.6 GByte/s megacell that interfaces to single or double byte wide DRAMs or logic chips is implemented using 0.35-0.18 /spl mu/m CMOS technologies. Special I/O circuits are used to guarantee 800 Mbit/s/pin data rate. Microwave PC board design metho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5372008df76c664fe430299c7f75ae4e
https://doi.org/10.1109/4.726545
https://doi.org/10.1109/4.726545
Publikováno v:
ISQED
A cost-minimized generation-spanning double die DRAM packaging (DDP) technology suitable for making ultra-high performance high-capacity server DIMMs for both the DDR3 and DDR4 DRAM generations was developed. Using existing wirebond-based manufacturi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c17065b1e4e30d0c2db8d718d292eb51
https://doi.org/10.1109/isqed.2012.6187546
https://doi.org/10.1109/isqed.2012.6187546