Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Richard Coyle"'
Autor:
I.S. Bae, Hong Chan Kim, Sung-Il Kang, Se Chuel Park, Larry Marcanti, John Marke, Richard Coyle, Joe Smetana
Publikováno v:
IMAPSource Proceedings. 2022
Lead-frames have been widely used in the semiconductor package assembly field, and QFN (Quad flat no leads) has the advantages of miniaturization and cost reduction of the semiconductor package. It has had limited use in automotive or defense product
Autor:
Prabjit Singh, L. Palmer, M. Hamid, T. Wassick, R. F. Aspandiar, B. Franco, H. Fu, Richard Coyle, Faramarz Hadian, V. Vasudevan, A. Allen, K. Howell, K. Murayama, H. Zhang, A. Lifton, M. Ribas, M. Sarangapani, T. Munson, S. Middleton
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Autor:
Bey Temsamani Abdellatif, M. Afendi, Z. Ahmad, N.A.M. Amin, Radostina A. Angelova, F.C. Ani, A.K. Ariffin, N.A. Aziz, Nan Cho, Joseph Colangelo, Maurice N. Collins, Richard Coyle, Eric Dalton, R. Daud, Zhili Dong, Emmanuel Ferrier, Mohammad A. Gharaibeh, Younan Hua, Víctor Hugo Jacobo, Xiaoming Li, Binghai Liu, M.S. Abdul Majid, Abdel Salam Hamdy Makhlouf, Zhiqiang Mo, A. Mohamad, Kenny Ong, E.P. Ooi, Armando Ortiz, Jeff Punch, Guang Ren, Carlos Rolando Rios-Soberanis, A.A. Saad, Z. Samsudin, Rafael Schouwenaars, Manh Tien Tran, Xuan Hong Vu, Jason Wheeler, W. John Wolfgong, Yuzhe Zhao, S. Zulfiqar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6253baffd9fa551ebaac08127fa65bb6
https://doi.org/10.1016/b978-0-08-101937-5.00021-x
https://doi.org/10.1016/b978-0-08-101937-5.00021-x
Autor:
Richard Coyle, Wilson Zhen, Brook Sandy-Smith, Kok Kwan Tang, Mark Krmpotich, Kevin Byrd, Qin Chen, Greg Wu, Shunfeng Cheng, Haley Fu, Jimmy Chen, Scott Mokler, Anny Zhang, Raiyo Aspandiar, Jagadeesh Radhakrishnan, Morgana Ribas, Sophia Feng
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Lowering peak reflow temperature from the current 240°C+ level for SnAgCu (SAC) solder paste during the assembly of electronic board products has economic, environmental and technical benefits. The Bi-Sn solder system is one low melting metallurgica
Autor:
Jimmy Chen, Anny Zhang, Mark Krmpotich, Morgana Ribas, Richard Coyle, Sophia Feng, Wilson Zhen, Qin Chen, Kok Kwan Tang, Jagadeesh Radhakrishnan, Haley Fu, Raiyo Aspandiar, Brook Sandy-Smith, Greg Wu, Shunfeng Cheng, Bill Hardin, Scott Mokler
Publikováno v:
2018 Pan Pacific Microelectronics Symposium (Pan Pacific).
In 2015, the International Electronics Manufacturing Initiative (iNEMI) initiated the Bismuth-Tin (Bi-Sn) based Low-Temperature Soldering Process and Reliability (LTSPR) Project. The goal of this project was to address the challenge of evaluating new
Autor:
Richard Coyle
Jerusalem occupied a problematic position during the development of the early Church, and the people who had cried out for Barabbas were not easily forgiven. Jean Boucher first published his Bouquet sacre compose des plus belles fleurs de la Terre sa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7763260a726fca9a61c8fa9cf901478
https://doi.org/10.1163/9789004236240_006
https://doi.org/10.1163/9789004236240_006
Autor:
Richard COYLE
Publikováno v:
Mail on Sunday. 6/6/2010, p36. 2p.