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pro vyhledávání: '"Richard Bisson"'
Autor:
Karen P. McLaughlin, David Turnbull, Chris Muzzy, Naftali E. Lustig, Danielle Degraw, Richard Bisson, Jason Gill, John P. Cincotta, Sylvain Ouimet, Joseph C. Ross, Edward Engbrecht
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
A review of the chip-to-package interaction (CPI) results during the development and qualification of IBM's 22SOI high performance technology will be presented. Initial results and failure modes using ultra low-k (ULK) dielectric BEOL during the earl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10cec1ca7fd3f2013eaba1c8d3e9401b
https://doi.org/10.1109/ectc.2013.6575602
https://doi.org/10.1109/ectc.2013.6575602
