Zobrazeno 1 - 10
of 35
pro vyhledávání: '"Ricardo C. Rangel"'
Autor:
Henrique L. Carvalho, Ricardo C. Rangel, Katia R. A. Sasaki, Paula G. D. Agopian, Leonardo S. Yojo, Joao A. Martino
Publikováno v:
2022 36th Symposium on Microelectronics Technology (SBMICRO).
Autor:
Pedro H. Duarte, Ricardo C. Rangel, Daniel A. Ramos, Leonardo S. Yojo, Carlos A.B. Mori, Katia R. A. Sasaki, Paula G. D. Agopian, Joao A. Martino
Publikováno v:
2022 36th Symposium on Microelectronics Technology (SBMICRO).
Autor:
Marcos N. Watanabe, Fábio Izumi, Ricardo C. Rangel, Sebastião G. Dos Santos Filho, Gabriel Oliveira Louzada, Stefanie Pereira Regis, Verônica Christiano Abê, William Tsuyoshi Shiga
Publikováno v:
Journal of Integrated Circuits and Systems. 15:1-5
This article discusses fabrication, characteriza-tion and studies of the C-V characteristics of SiO layers depos-ited by PVD on Si-p substrates with doping around 1x1016 cm-3. MOS capacitors (Metal-Oxide-Semiconductor) with Al/SiO2/Si-P, Al/SiO/Si-P
Publikováno v:
Journal of Integrated Circuits and Systems. 15:1-6
This work analyzes the third generation BESOI MOSFET (Back-Enhanced Silicon-On-Insulator Metal-Oxide-Semiconductor Field-Effect-transistor) built on UTBB (Ultra-Thin Body and Buried Oxide), comparing it to the BESOI with thick buried oxide (first gen
Publikováno v:
ECS Transactions. 97:115-120
The Back Enhance (BE) SOI MOSFET is a device whose operation can be tuned by the back gate bias (VGB), i.e., it can act as an n- or p-type MOSFET if VGB is positive or negative enough, respectively. This characteristic was explored in the bio-sensing
Publikováno v:
2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS).
The study of a dielectric-modulated biosensor built on the BESOI MOSFET structure showed a crossing point of the transfer characteristics curves for target biomaterials with different dielectric constants (CID – Current Invariant Dielectric). The C
Publikováno v:
2021 35th Symposium on Microelectronics Technology and Devices (SBMicro).
In this work, an improvement of Schottky junction was performed for application in Back Enhanced BESOI MOSFET. It was observed that the formation of NiSi prior to the deposition of the aluminum on it, protects the Schottky junction from the aluminum
Autor:
Sebastião G. Dos Santos Filho, Ricardo C. Rangel, Gabriel Oliveira Louzada, Marcos N. Watanabe
Publikováno v:
2021 35th Symposium on Microelectronics Technology and Devices (SBMicro).
This article discusses the use of glass coverslips with thickness in the range of 70 to 108 µm as anti-reflection layers in order to increase the efficiency of MOS photovoltaic cells with Al/SiO 2 (1.7 nm)/Si-P structure fabricated on 10 Ω.cm subst
Publikováno v:
2021 35th Symposium on Microelectronics Technology and Devices (SBMicro).
This paper reports the study of the Back Enhanced SOI (BESOI) MOSFET improvement through the inclusion of ndoped regions on the drain and source regions underlapped with the gate. This study was performed using TCAD Synopsys Sentaurus simulator. The
Publikováno v:
ECS Transactions. 85:79-84