Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Ribeiro, Pedro Emanuel Abreu"'
Autor:
Castro, Carlos Eduardo Rodrigues, Fraga, Lelis, Ferreira, Manuel Eduardo Cardoso, Martins, Jorge, Ribeiro, Pedro Emanuel Abreu, Teixeira, J. Carlos
The combustion of wood pellets in a fixed bed combustor of a 20 kW capacity domestic pellet boiler was tested according to several factors including Power, Excess Air (EA), Primary/Secondary air Split Ratio (SR) and Grate Area (GA). The Taguchi metho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______307::f179c1302b93cb3a3658aeb30bebcf4f
https://hdl.handle.net/1822/76935
https://hdl.handle.net/1822/76935
Autor:
Ribeiro, Pedro Emanuel Abreu, Soares, Delfim, Cerqueira, M. F., Teixeira, S. F. C. F., Barros, Daniel Araújo, Teixeira, J. Carlos
A common failure mode of electronic PCB’s is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______307::002a1febb07df637f4d789b8d5600e69
https://hdl.handle.net/1822/53400
https://hdl.handle.net/1822/53400
Autor:
Barbosa, Flávia Vieira, Ribeiro, Pedro Emanuel Abreu, Cerqueira, M. F., Soares, Delfim, Teixeira, J. Carlos, Teixeira, S. F. C. F., Lima, Rui Alberto Madeira Macedo, Pinho, Diana
Reflow soldering process is widely implemented in the electronics industry. This method allows the attachment of electronic components to a printed circuit board (PCB) through the melting of solder paste, which makes the interconnection between them.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______307::87626f380cdbdd80c9b832942eb26907
https://hdl.handle.net/1822/53395
https://hdl.handle.net/1822/53395
Autor:
Teixeira, J. Carlos, Teixeira, S. F. C. F., Soares, Delfim, Cerqueira, M. F., Barbosa, Flávia Vieira, Silva, João Pedro Vasconcelos, Ribeiro, Pedro Emanuel Abreu, Santos, Duarte
Air jet impingement technology receives considerable attention due to its high performance for heat transfer enhancement in thermal equipment, providing high heat transfer rates. Due to its inherent characteristics of high average heat transfer coeff
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______307::697afd4ea9aeb5398e5ba5469526dfcb
https://hdl.handle.net/1822/71713
https://hdl.handle.net/1822/71713
Autor:
Ribeiro, Pedro Emanuel Abreu, Soares, Delfim, Cerqueira, M. F., Teixeira, S. F. C. F., Barros, Daniel Araújo, Teixeira, J. Carlos, Capela, Paulina Araújo, Macedo, Francisco
A common failure mode of electronic printed circuit boards (PCB’s) is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______307::aa0e31a2bd6b736da1e419600daa08f6
https://hdl.handle.net/1822/71714
https://hdl.handle.net/1822/71714
Autor:
Ribeiro, Pedro Emanuel Abreu
Publikováno v:
Repositório Científico de Acesso Aberto de Portugal
Repositório Científico de Acesso Aberto de Portugal (RCAAP)
instacron:RCAAP
Repositório Científico de Acesso Aberto de Portugal (RCAAP)
instacron:RCAAP
Dissertação de mestrado em Engenharia Mecânica
O mercado de equipamentos de queima de pellets residenciais está já bastante desenvolvido em alguns países da Europa como Alemanha, Áustria e Itália. Em Portugal, encontra-se ainda numa fase
O mercado de equipamentos de queima de pellets residenciais está já bastante desenvolvido em alguns países da Europa como Alemanha, Áustria e Itália. Em Portugal, encontra-se ainda numa fase
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::c75ec2a0b689a6677273284b8234a000
https://hdl.handle.net/1822/22600
https://hdl.handle.net/1822/22600