Zobrazeno 1 - 10
of 43
pro vyhledávání: '"Rhee, Min Woo"'
Publikováno v:
Journal of Electronic Materials. 43:2498-2509
Hermetic sealing of micro-electro mechanical systems (MEMS) sensors for down-hole application requires high-quality void-free bonds, with metallic hermetic sealing being widely used for this purpose. As most of the MEMS sensors cannot withstand high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::473f3a598166e1aebdd5c42b2f81d6eb
https://doi.org/10.1007/s11664-014-3131-4
https://doi.org/10.1007/s11664-014-3131-4
Akademický článek
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Publikováno v:
Microelectronics Reliability. 53:1548-1552
The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::38c6c814a1ff2e942b06de240a9e47dd
https://doi.org/10.1016/j.microrel.2013.07.016
https://doi.org/10.1016/j.microrel.2013.07.016
Publikováno v:
Journal of Electronic Materials. 42:2803-2812
Cyanate ester resin-based composite materials have been proposed as potential encapsulants for high-temperature applications. The objective of this study is to develop a cyanate ester-based encapsulant, which can also serve as a flip-chip underfill a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd3a018dd2c86d26611ca40b90437cf1
https://doi.org/10.1007/s11664-013-2665-1
https://doi.org/10.1007/s11664-013-2665-1
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
In this paper, authors developed miniaturizeddouble side cooling packaging for SiC (silicon carbide) highpower inverter module using new material solutions towithstand high temperature condition over 220oC. Instead ofconventional thick wire bonding o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6589bdc2e2773bf709c1894279da6eb
https://doi.org/10.1109/ectc.2016.396
https://doi.org/10.1109/ectc.2016.396
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Traditional stacking chips for memory had been inter-connected with wire bonding method. Three-dimensional (3D) die stacking with through-Si via (TSV) which has advantages such as shorter signal length and smaller footprint has been researched and ap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb88105965e010a07bf07ef2a675a25a
https://doi.org/10.1109/ectc.2016.316
https://doi.org/10.1109/ectc.2016.316
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Ag sintering has been widely studied as a lead-free die attach solution for power electronics. A soak time of a dozen minutes at the sintering temperature is necessary to establish strong bond strength by the conventional heating method. Chemical bon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6800f19465e1a3911beba67dc0ac205
https://doi.org/10.1109/eptc.2015.7412369
https://doi.org/10.1109/eptc.2015.7412369
Autor:
Hwang How Yuan, Yeap Yean Wei, Norhanani Binte Jaafar, Lee Jong Bum, Sorono Dexter Velez, Daniel Rhee Min Woo
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
While leadframe has come a long way as a cost effective substrate, there is still limitation over its design rule. In this article, the authors have developed and put to test a SiC based PQFN using 70μm single metal layer substrates, allowing furthe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75e0542139c6a40cad3afef9bb0d1cc4
https://doi.org/10.1109/eptc.2015.7412299
https://doi.org/10.1109/eptc.2015.7412299
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Lead-free solder alloys for high temperature applications is required to meet increasing demands for reliable replacements for lead-based alloys. Especially, high temperature solder is required for bonding in power electronics packages where first bo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8edaca5392fbfee5f61c7685b74b1c07
https://doi.org/10.1109/eptc.2015.7412304
https://doi.org/10.1109/eptc.2015.7412304
Akademický článek
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